Camera module and optical apparatus for minimizing the whole height thereof

ABSTRACT

The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication Nos. 10-2016-0008532 and 10-2016-0008534, filed Jan. 25,2016; and 10-2016-0010739, filed Jan. 28, 2016, which are herebyincorporated by reference in their entirety.

TECHNICAL FIELD

Exemplary embodiments of the present disclosure may relate to a cameramodule and an optical apparatus.

BACKGROUND

The technology described in this section is merely intended to providebackground, information of an exemplary embodiment of the presentdisclosure, and does not mean the prior art.

Concomitant with wide propagation of various mobile terminals (smartphones) and commercialization of wireless Internet services, demands byconsumers related to the mobile terminals are diversified, and varioustypes of additional equipment are attached to the mobile terminals.

Among the various types of additional equipment, a camera module may bea representative device capable of photographing a subject in a stillimage or in a moving picture.

Meanwhile, recent camera modules are equipped with AF (Auto Focus)functions and handshake correction functions as a basic specification.However, the conventional camera modules having the handshake correctionfunction suffer from disadvantages in that a camera module part alone onthe mobile terminal protrudes from the mobile terminal due to increasedwhole length of the camera module, which is resultant from use of thehandshake correction function.

Meantime, there is a need of alignment of a lens module with an opticalaxis of an image sensor in order to assemble a camera module. Theoptical axis alignment may be performed by full curing for assembly of acamera module prior to temporary curing thereof, while the optical axisalignment is being completed.

On the other hand, the conventional camera module suffers from drawbacksin that the temporary curing for assembly of a camera module is notperformed in a proper manner to twist a position during movement; and atime for temporary curing process becomes increased in order tointegrate temporary adhesion stability.

BRIEF SUMMARY Technical Challenge

In order to solve at least one or more of the above problems and/ordisadvantages in whole or in part and to provide at least advantagesdescribed hereinafter, a first exemplary embodiment of the presentdisclosure is to provide a camera module minimized in the whole lengthto an optical axis direction. The present disclosure provides an opticalapparatus including the camera module.

In order to solve at least one or more of the above problems and/ordisadvantages in whole or in part, a second exemplary embodiment of thepresent disclosure is to provide a camera module configured to improve acuring stability of IR (Infrared) rays and secure reliability forprocessing and module by changing an exterior shape of a sensor base ora housing of a lens driving unit.

The present disclosure provides a camera module enlarged in lightirradiation angle in order to effectively perform an IR curing in an AA(Active Alignment) process. Furthermore, the present disclosure providesan optical apparatus including a camera module.

Technical Solution

In accordance with a first exemplary embodiment of the presentinvention, there is provided a camera module, the camera modulecomprising: a circuit board; an image sensor disposed on an uppersurface of the circuit board; a current carrying part electricallyconnecting the image sensor and the circuit board; and a base disposedon the upper surface of the circuit board, wherein the base is notoverlapped with the image sensor and the current carrying part in adirection of an optical axis.

In some exemplary embodiments, the camera module may further comprise: alens module arranged at an upper side of the image sensor; and a filterinterposed between the lens module and the image sensor, wherein thebase may include a first support unit supporting a part of a bottomsurface of the filter, a second support unit disposed opposite to alateral surface of the filter, and a third support unit arranged at anupper surface of the circuit board to connect the first and secondsupport units.

In some exemplary embodiments, a bottom surface of the first supportunit may contact the upper surface of the circuit board.

In some exemplary embodiments, a width of the first support unit in adirection perpendicular to a direction of an optical axis (hereinafterreferred to as optical axis direction) may be broadened toward an upperside from a lower end of the first support unit.

In some exemplary embodiments, an upper surface of the first supportunit and an inner lateral surface of the first support unit may form anacute angle.

In some exemplary embodiments, a height of the second support unit inthe optical axis direction may correspond to a height of the filter inthe optical axis direction.

In some exemplary embodiments, an upper surface of the filter and anupper surface of the second support unit may be arranged on one plane.

In some exemplary embodiments, the filter may be spaced apart from theimage sensor and the current carrying part.

In some exemplary embodiments, the filter may be an IR absorption filteror an IR reflection filter.

In some exemplary embodiments, the current carrying part may include awire coupled to an upper surface of the image sensor and an uppersurface of the circuit board:

In some exemplary embodiments, the wire may be arranged at an externalside of the image sensor.

In some exemplary embodiments, the camera module may further comprise: acover member arranged at an upper side of the base; a bobbin arranged atan inner side of the cover member; a first coil arranged at the bobbin;a magnet interposed between the cover member and the bobbin to beopposite to the first coil; and a second coil arranged at the base to beopposite to the magnet.

In some exemplary embodiments, the camera module may further comprise acircuit element unit arranged at an upper surface of the circuit boardand arranged at an outside of the image sensor, wherein the base may beformed with an element accommodation part accommodating at least a partof the circuit element unit.

In some exemplary embodiments, the element accommodation part may passthrough the base to an optical axis direction.

In some exemplary embodiments, the base may be prevented from beingoverlapped with the circuit element unit in an optical axis direction.

In some exemplary embodiments, the element accommodation part mayinclude a first accommodation part arranged at one side of the imagesensor and a second accommodation part arranged at the other side of theimage sensor.

In some exemplary embodiments, the circuit element unit may includefirst to fourth circuit elements, each element mutually spaced apartfrom the other element, and the element accommodation part may include afirst accommodation part accommodating the first and second circuitelements, and a second accommodation part accommodating the third andfourth circuit elements, and the first accommodation part and the secondaccommodation part may be spaced apart from each other by the base.

In some exemplary embodiments, the camera module may further comprise: acover member arranged at an upper side of the base; a lens modulearranged at an upper side of the image sensor; and a filter interposedbetween the lens module and the image sensor, wherein the base mayinclude a filter support part supporting the filter, and a cover membersupport part supporting the cover member, and wherein the elementaccommodation part may be arranged between the filter support part andthe cover member support part.

The optical apparatus according to a first exemplary embodiment of thepresent disclosure may comprise: a main body; a camera module arrangedat the main body to photograph an image of a subject; and a display partarranged at one surface of the main body to output the imagephotographed by the camera module, wherein the camera module maycomprise: a circuit board; an image sensor disposed on an upper surfaceof the circuit board; a current carrying part electrically connectingthe image sensor and the circuit board; and a base disposed at the uppersurface of the circuit board, wherein the base is not overlapped withthe image sensor and the current carrying part in a direction of anoptical axis.

In some exemplary embodiments, the optical apparatus may furthercomprise a circuit element unit arranged at an upper surface of thecircuit board, and arranged at an outside of the image sensor, whereinthe base may be formed with an element accommodation part accommodatingat least a part of the circuit element unit.

A camera module according to a first exemplary embodiment of the presentdisclosure may comprise: a circuit board; an image sensor disposed on anupper surface of the circuit board; a current carrying part electricallyconnecting the image sensor and the circuit board; and a base disposedon the upper surface of the circuit board, wherein the base may beprevented from being overlapped with the image sensor and the currentcarrying part in an optical axis direction.

The camera module may include a lens module arranged at an upper side ofthe image sensor, and a filter interposed between the lens module andthe image sensor, wherein the base may include a first support unitsupporting a part of a bottom surface of the filter, a second supportunit disposed opposite to a lateral surface of the filter, and a thirdsupport unit disposed at an upper surface of the circuit board toconnect the first and second support units.

In some exemplary embodiments, a bottom surface of the first supportunit may contact the upper surface of the circuit board.

In some exemplary embodiments, a width of the first support unit in adirection perpendicular to a direction of the optical axis direction maybe broadened toward an upper side from a lower end of the first supportunit.

In some exemplary embodiments, a height of the second support unit inthe optical axis direction may correspond to a height of the filter inthe optical axis direction.

In some exemplary embodiments, the filter may be spaced apart from theimage sensor and the current carrying part.

In some exemplary embodiments, the filter may include at least one ormore of an IR absorption filter and an IR reflection filter.

In some exemplary embodiments, the current carrying part may include awire disposed at an outside of the image sensor.

In some exemplary embodiments, the camera module may further include: acover member disposed at an upper side of the base; a bobbin disposed atan inner side of the cover member; a first driving part disposed at thebobbin; a second driving part interposed between the cover member andthe bobbin to be disposed opposite to the first driving part; and athird driving part disposed at the bobbin to be positioned opposite tothe second driving part.

In some exemplary embodiments, the first driving part may include afirst coil unit, the second driving part may include a magnet unit andthe third driving part may include a second coil unit.

The optical apparatus according to a first exemplary embodiment of thepresent disclosure may comprise: a circuit board; an image sensordisposed at an upper surface of the circuit board; a current carryingpart electrically connecting the image sensor and the circuit board; anda base disposed at the upper surface of the circuit board, wherein thebase may be prevented from being overlapped with the image sensor andthe current carrying part in an optical axis direction.

A camera module according to a modification of a first exemplaryembodiment of the present disclosure may comprise: a circuit board; animage sensor disposed at an upper surface of the circuit board; acircuit element unit disposed at an upper surface of the circuit boardto be positioned at an outside of the image sensor; and a base disposedat the upper surface of the circuit board, wherein the base may beformed with an element accommodation part accommodating at least a partof the circuit element unit.

In some exemplary embodiments, the element accommodation part may passthrough the base in an optical axis direction.

In some exemplary embodiments, the base may be prevented from beingoverlapped with the circuit element unit in an optical axis direction.

In some exemplary embodiments, the element accommodation part mayinclude a first accommodation part disposed at one side of the imagesensor, and a second accommodation part disposed at the other side ofthe image sensor.

In some exemplary embodiments, the circuit element unit may includefirst to fourth circuit elements, each element mutually spaced apartfrom the other element, and the element accommodation part may include afirst accommodation part accommodating the first and second circuitelements, and a second accommodation part accommodating the third andfourth circuit elements, and the first accommodation part and the secondaccommodation part may be spaced apart from each other by the base.

In some exemplary embodiments, the camera module may further comprise: acover member disposed at an upper side of the base; a lens moduledisposed at an upper side of the image sensor; and a filter interposedbetween the lens module and the image sensor, wherein the base mayinclude a filter support part supporting the filter, and a cover membersupport part supporting the cover member, and wherein the elementaccommodation part may be disposed between the filter support part andthe cover member support part.

In some exemplary embodiments, the filter support part may include afirst support unit supporting a part of a bottom surface of the filter,a second support unit disposed opposite to a lateral surface of thefilter, and a third support unit disposed at an upper surface of thecircuit board to connect the first support unit and the second supportunit, wherein a length to an optical axis direction of the cover membersupport part may correspond to a length to an optical axis direction ofthe first support unit.

In some exemplary embodiments, a length to an optical axis direction ofthe second support unit may correspond to a length to an optical axisdirection of the filter.

In some exemplary embodiments, the filter may include at least one ormore of an IR absorption filter and an IR reflection filter.

In some exemplary embodiments, the camera module may further include: acover member disposed at an upper side of the base; a bobbin disposed atan inner side of the cover member; a first driving part disposed at thebobbin; a second driving part interposed between the cover member andthe bobbin to be disposed opposite to the first driving part; and athird driving part disposed at the base to be positioned opposite to thesecond driving part.

In some exemplary embodiments, the first driving part may include afirst coil unit, the second driving part may include a magnet unit andthe third driving part may include a second coil unit.

An optical apparatus according to a modification of a first exemplaryembodiment of the present disclosure may comprise: a circuit board; animage sensor disposed at an upper surface of the circuit board; acircuit element unit disposed at an upper surface of the circuit boardto be positioned at an outside of the image sensor; and a base disposedat the upper surface of the circuit board, wherein the base may beformed with an element accommodation part accommodating the circuitelement unit to pass through the base to an optical axis direction.

A camera module according to a second exemplary embodiment of thepresent disclosure may comprise: a circuit board; an image sensordisposed at an upper surface of the circuit board; a sensor basedisposed at an upper surface of the circuit board to accommodate theimage sensor at an inside thereof; and a lens driving unit coupled tothe sensor base, wherein the sensor base may include a first externalsurface, a second external surface adjacent to (neighboring with) thefirst external surface, and a first corner part interposed between thefirst external surface and the second external surface, and wherein thesensor base may include a guide part disposed at the first corner partand formed by being caved in at a part of an upper surface of the sensorbase.

In some exemplary embodiments, a length to an optical axis directionfrom a center part of the first external surface may be longer than alength to an optical axis direction at a first corner part side.

In some exemplary embodiments, the guide part may include a chamfer parthaving a chamfer shape.

In some exemplary embodiments, the guide part may include a firstchamfer part having a first slope, and a second chamfer part having asecond slope different from the first slope, wherein the first chamferpart and the second chamfer part may be continuously arranged from aninside to an outside.

In some exemplary embodiments, a length to an optical axis direction ofthe first external surface may grow smaller toward a first corner partfrom a center of the first external surface.

In some exemplary embodiments, the sensor base may further include athrough hole passing through the sensor base to an optical axisdirection, wherein the through hole may be disposed at an upper side ofthe image sensor, a first internal surface of the sensor base formingthe through hole is disposed opposite to the first external surface, anda length to an optical axis direction at a center of the first externalsurface may be equal to or longer than a length to an optical axisdirection of the first internal surface.

In some exemplary embodiments, the sensor base may include a filteraccommodation part formed by being caved in (sunk) from a bottom side ata part of the upper surface of the sensor base, wherein the filteraccommodation part may accommodate an IR (Infrared) filter, and whereinthe IR filter may be disposed at an upper side of the image sensor.

In some exemplary embodiments, the camera module may further comprise anadhesive member interposed between the lens driving unit and the uppersurface of the sensor base, wherein the adhesive member may be cured byIR.

In some exemplary embodiments, the sensor base may further include: athird external surface adjacent to (neighboring with) the secondexternal surface; a fourth external surface adjacent to the firstexternal surface and the third external surface; a second corner partinterposed between the second external surface and the third externalsurface; a third corner part interposed between the third externalsurface and the fourth external surface; and a fourth corner partinterposed between the fourth external surface and the first externalsurface, wherein the guide part may be respectively disposed at thefirst to fourth corner part of the sensor base.

In some exemplary embodiments, the lens driving unit may include: abobbin coupled by a lens module; a housing disposed at an outside of thebobbin; a first elastic member coupled to the bobbin and the housing; afirst driving part disposed at the bobbin; and a second driving partdisposed at the housing and positioned opposite to the first drivingpart.

There is provided an optical apparatus according to a second exemplaryembodiment of the present disclosure, the optical apparatus comprising:a circuit board; an image sensor disposed at an upper surface of thecircuit board; a sensor base disposed at an upper surface of the circuitboard to accommodate the image sensor at an inside thereof; and a lensdriving unit coupled to an upper side of the sensor base, wherein thesensor base may include a first external surface, a second externalsurface adjacent to (neighboring with) the first external surface, and afirst corner part interposed between the first external surface and thesecond external surface, and wherein the sensor base may include a guidepart disposed at the first corner part and formed by being caved in at apart of an upper surface of the sensor base.

Advantageous Effect

An FBL (Flange Back Length), a distance from an upper surface of animage sensor to a bottom surface of a lens module can be minimized,through the first exemplary embodiment of the present disclosure.

A thickness of a base can be reduced by opening a ceiling of a base atan upper side of a circuit element, through the modification accordingto the first exemplary embodiment of the present disclosure.

Furthermore, it may be possible to reduce a position of a bottom endsurface of a lens driving unit when a relevant design is applied.

An IR (Infrared) introduction space can be enlarged by securing a spacebetween a corner of a sensor base and a corner of a lens driving unit,through the second exemplary embodiment of the present disclosure.

Furthermore, it is possible to increase a temporary stability for a lensposition due to obtainment of IR curing energy.

Still furthermore, productivity can be increased by decrease in a curingtime.

In addition, a size that is increased by supplementary operation can beprevented by providing a space capable of performing a supplementaloperation for additional adhesive, using an external corner space. Thatis, an over-dimensional error can be prevented that may occur after thesupplemental operation for additional adhesive in order to increase anadhesive power between a sensor base and a lens driving unit.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plane view illustrating a camera module according to a firstexemplary embodiment of the present disclosure.

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1.

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1.

FIG. 4 is a plane view illustrating a partial configuration of a cameramodule according to a first exemplary embodiment of the presentdisclosure.

FIG. 5 is a cross-sectional view taken along line C-C of FIG. 4.

FIG. 6 is an exploded perspective view of a lens driving unit accordingto a first exemplary embodiment of the present disclosure.

FIG. 7 is a cross-sectional view illustrating a camera module accordingto (a) a comparative example and (b) an exemplary embodiment of thepresent disclosure in order to explain an effect of a first exemplaryembodiment of the present disclosure.

FIG. 8 is cross-sectional view illustrating a partial configuration of acamera module according to a modification of a first exemplaryembodiment of the present disclosure.

FIG. 9 is a perspective view of a camera module according to a secondexemplary embodiment of the present disclosure.

FIG. 10 is an exploded perspective view of a camera module according toa second exemplary embodiment of the present disclosure.

FIG. 11 is a perspective view of a sensor base according to a secondexemplary embodiment of the present disclosure.

FIG. 12 is a plane view of a sensor base according to a second exemplaryembodiment of the present disclosure.

FIG. 13 is a lateral view of a sensor base according to a secondexemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure aredescribed in detail with reference to the accompanying drawings. It willbe appreciated that for simplicity and/or clarity of illustration,elements illustrated in the figure have not necessarily been drawn toscale. For example, the dimensions of some of the elements may beexaggerated relative to other elements for clarity. Accordingly, in someembodiments, well-known processes, well-known device structures andwell-known techniques are not illustrated in detail to avoid unclearinterpretation of the present disclosure. The same reference numberswill be used throughout the specification to refer to the same or likeparts.

It will be understood that, although the terms first, second, A, B, (a),(b), etc. may be used herein to describe various elements, components,regions, layers, and/or sections, these elements, components, regions,layers, and/or sections should not be limited by these terms. Theseterms are only used to distinguish one element, component, region,layer, and/or section from another element, component, region, layer,and/or section.

Thus, a first element, component, region, layer, or section discussedbelow could be termed a second element, component, region, layer, orsection without departing from the teachings of example embodiments.

In the following description and/or claims, the terms coupled and/orconnected, along with their derivatives, may be used. In particularembodiments, connected may be used to indicate that two or more elementsare in direct physical and/or electrical contact with each other.Coupled may mean that two or more elements are in direct physical and/orelectrical contact. However, coupled may also mean that two or moreelements may not be in direct contact with each other, but yet may stillcooperate and/or interact with each other. For example, “coupled”, and“connected” may mean that two or more elements do not contact each otherbut are indirectly joined together via another element or intermediateelements.

The “optical axis direction” hereinafter used may be defined as anoptical axis direction of a lens module while being coupled to anoptical lens assembly. Meantime, the “optical axis direction” may beinterchangeably used with a up/down direction, a z axis direction, and avertical direction.

The below-used “auto focus function” may be defined as a function ofmatching a focus to a subject by adjusting a distance from an imagesensor by moving a lens module to an optical axis direction in responseto a distance from a subject in order to obtain a clear image of thesubject by the image sensor.

The below-used “handshake correction function” may be defined as afunction to move or tilt a lens module to an optical axis direction andvertical direction in order to offset a vibration (movement) generatedonto an image sensor by an external force. Meantime, the “handshakecorrection” may be interchangeably used with “OIS (Optical ImageStabilization)”.

The below-used “FBL” is an abbreviation of Flange Back Length, and meansa distance from an upper surface of an image sensor to a bottom surfaceof the lens module. FBL is illustrated in FIG. 7 as L1 and L2.

Hereinafter, one of an AF coil part (7220), a driving magnet part (7320)and an OIS coil part (7410) may be referred to as a “first drivingpart”, and another one may be referred to as a “second driving part”,and a remaining one may be referred to as a “third driving part”.

Now, a configuration of an optical apparatus according to a firstexemplary embodiment of the present disclosure will be described.

An optical apparatus may include a mobile phone, a smart phone, a mobilesmart device, a digital camera, a notebook computer (laptop computer), adigital broadcasting terminal, a PDA (Personal Digital Assistant), a PMP(Portable Multimedia Player), and a navigation device. The presentdisclosure is not limited thereto, and any device for photographing animage or a still photo may be used for an optical apparatus.

The optical apparatus may include a main body (not shown), a cameramodule and a display part (not shown). However, it may be possible todelete or change more than any one of the main body, camera module anddisplay part from the optical apparatus.

The main body may form an external look of the optical apparatus. Forexample, the main body may take a shape of a rectangular parallelepiped.For another example, the main body of a rectangular parallelepiped shapemay be formed in at least one part with a rounded corner. The main bodymay accommodate a camera module. One surface of the main body may bearranged with a display part. For example, one surface of the main bodymay be arranged with a display part and a camera module, while the othersurface (a surface opposite to the one surface) of the main body may beadditionally arranged with a camera module.

The camera module may be arranged at the main body. The camera modulemay be arranged at one surface of the main body. At least a part of thecamera module may be accommodated in the main body. The camera modulemay be formed in a plural number. The plurality of camera modules may berespectively arranged at one surface of the main body and the othersurface of the main body. The camera module can photograph an image of asubject.

The display part may be arranged at the main body. The display part maybe arranged at one surface of the main body. That is, the display partmay be arranged at a same surface as that of the camera module.Alternatively, the display part may be arranged at the other surface ofthe main body. The display part may be arranged at a surface positionedopposite to a surface arranged with the camera module. The display partmay output an image photographed by the camera module.

Now, configuration of a camera module according to a first exemplaryembodiment of the present disclosure may be described with reference tothe accompanying drawings.

FIG. 1 is a plane view illustrating a camera module according to a firstexemplary embodiment of the present disclosure, FIG. 2 is across-sectional view taken along line A-A of FIG. 1, FIG. 3 is across-sectional view taken along line B-B of FIG. 1, FIG. 4 is a planeview illustrating a partial configuration of a camera module accordingto a first exemplary embodiment of the present disclosure, FIG. 5 is across-sectional view taken along line C-C of FIG. 4, and FIG. 6 is anexploded perspective view of a lens driving unit according to a firstexemplary embodiment of the present disclosure.

The camera module may include a circuit board (100), an image sensor(200), a current carrying part (300), a first base (400), a lens module(500), a filter (600), a lens driving unit (700) and a circuit elementunit (800). However, any one or more of the circuit board (100), theimage sensor (200), the current carrying part (300), the first base(400), the lens module (500), the filter (600), the lens driving unit(700) and the circuit element unit (800) may be omitted.

The circuit board (100) may be disposed at an upper surface with animage sensor (200). The circuit board (100) may be electricallyconducted to the image sensor (200) through a current carrying part(300). The circuit board (100) may be disposed at an upper surface witha first base (400). The circuit board (100) may be disposed at an innerside of the upper surface with the image sensor (200), and may bedisposed at an outside with the first base (400). The circuit board(100) may be disposed at an upper surface with a third support unit(413) of the first base (400). The circuit board (100) may be contactedat an upper surface by a bottom surface of a first support unit (411) ofthe first base (400). The circuit board (100) may supply an electricpower to first to third driving units (not shown). The circuit board(100) may be disposed with a controller in order to control the first tothird driving units.

The image sensor (200) may be disposed at an upper surface of thecircuit board (100). The image sensor (200) may be electricallyconnected to the circuit board (100) through the current carrying part(300). The image sensor (200) may be prevented from being overlappedwith the first base (400) in the optical axis direction. The imagesensor (200) may be disposed at an upper side with a lens module (500).The filter (600) may be interposed between the image sensor (200) andthe lens module (500). The image sensor (200) may be spaced apart fromthe filter (600). The image sensor (200) may be disposed at an outsidewith a current carrying part (300).

The image sensor (200) may be mounted on the circuit board (100). Theimage sensor (200) may be accommodated at an inside of the first base(400). The image sensor (200) may be so disposed as to conform to thelens module (500) in terms of optical axis, whereby the image sensor(200) can obtain a light having passed the lens module (500). The imagesensor (200) may output the obtained light in an image. The image sensor(200) may include any one or more than any one of a CCD (Charged CoupledDevice), a MOS (Metal Oxide Semi-Conductor), a CPD and a CID. However,the present disclosure is not limited thereto.

The current carrying part (300) may electrically connect the imagesensor (200) and the circuit board (100). The current carrying part(300) may be prevented from being overlapped with the first base (400)in the optical axis direction. The current carrying part (300) may bespaced apart from the filter (600). The current carrying part (300) mayinclude a wire loop disposed at an outside of the image sensor (200).The first base (400) may be disposed at an outside of the wire loop.That is, the first base (400) may be escaped to an outside of the wireloop.

The first base (400) may be disposed at an upper surface of the circuitboard (100). The lens driving unit (700) may be disposed at an upperside of the first base (400). A cover member (7100) may be disposed atan upper side of the first base (400). The first base (400) may bedisposed with an OIS coil part (7410). Meantime, any one of the firstbase (400) and a second base (7500) of the lens driving unit (700) maybe omitted. Furthermore, the first base (400) and the second base (7500)of the lens driving unit (700) may be integrally formed.

The first base (400) may not be overlapped with the image sensor (200)in the optical axis direction. The first base (400) may not beoverlapped with the current carrying part (300) in the optical axisdirection. Through this structure (thus described) of the firstexemplary embodiment of the present disclosure, a FBL (Flange BackLength) which is a distance from an upper surface of the image sensor(200) to a bottom surface of the lens module (500) can be minimized.Furthermore, a whole length of a camera module can be minimized by theminimized FBL according to the first exemplary embodiment of the presentdisclosure.

The first base (400) may not be overlapped with the circuit element unit(800) in the optical axis direction. That is, an upper side of thecircuit element unit (800) may be opened. A position of a bottom end ofthe lens driving unit (700) can be reduced through this structure,whereby a whole length of a camera module can be also minimized.

The first base (400) may include a filter support part (410) supportingthe filter (600). The first base (400) may include a cover membersupport part (420) supporting a cover member (7100). Furthermore, thefirst base (400) may be formed with an element accommodation part (430)disposed at a position between the filter support part (410) and thecover member support part (420) to accommodate the circuit element unit(800). The first base (400) may be formed with the element accommodationpart (430) to accommodate the circuit element unit (800) and to passthrough the first base (400) in an optical axis direction.

The filter support part (410) may be spaced (distanced) apart from atleast a part of the cover member support part (420). The filter supportpart (410) may be formed with an element accommodation part (430) at adiscrete space between the filter support part (410) and the covermember support part (420). The filter support part (410) may include afirst support unit (411) supporting a part of a bottom surface of thefilter (600). The filter support part (410) may include a second supportunit (412) opposite to a lateral surface of the filter (600). The filtersupport part (410) may include a third support unit (413) disposed at anupper surface of the circuit board (100) to connect the first and secondsupport units (411, 412).

The first support unit (411) may support a part of a bottom surface ofthe filter (600). A bottom surface of the first support unit (411) maycontact an upper surface of the circuit board (100). That is, the firstsupport unit (411) may be directly supported by the circuit board (100).A width of the first support unit (411) to a direction (horizontaldirection) perpendicular to an optical axis direction may be enlargedtoward an upper side from a bottom end of the first support unit (411).That is, the first support unit (411) may be extended from an uppersurface of the circuit board (100) to a bottom surface of the filter(600) in order to have a slope.

The second support unit (412) may face a later surface of the filter(600). A height of the second support unit (412) in on optical axisdirection may correspond to a height of the filter (600) in an opticalaxis direction. That is, the second support unit (412) may not beprotruded over the filter (600) toward an upper side.

The third support unit (413) may connect the first and second supportunits (411, 412). The third support unit (413) may be disposed at anupper surface of the circuit board (100). The first to third supportunits (411, 412, 413) may be integrally formed.

The cover member support part (420) may be disposed between the covermember (7100) and the circuit board (100). A bottom surface of the covermember support part (420) may be positioned with a bottom end of thecover member (7100).

A length of the cover member support part (420) in the optical axisdirection may correspond to a length of the first support unit (411) inthe optical axis direction. The length of the cover member support part(420) in the optical axis direction may be smaller than a length of thefilter support part (410) in the optical axis direction. That is, theheight of the cover member support part (420) may be lower than that ofthe filter support part (410). Thus, a position of a bottom end surfaceof the lens driving unit (700) supported at a bottom end surface by thecover member support part (420) may be reduced, whereby a whole lengthof a camera module can be minimized.

The element accommodation part (430) may be formed by omitting a part ofthe first base (400). The element accommodation part (430) may beinterposed between the filter support part (410) and the cover membersupport part (420). The element accommodation part (430) may be openedat an upper surface. That is, the circuit element unit (800)accommodated into the element accommodation part (430) may be openedtoward an upper side. The element accommodation part (430) mayaccommodate the circuit element unit (800). The element accommodationpart (430) may pass through the base (400) in the optical axisdirection.

The element accommodation part (430) may include a plurality ofaccommodation parts. The element accommodation part (430) may includefirst to fourth accommodation parts (431, 432, 433, 434), each mutuallyspaced apart from the other part. However, the number of accommodationparts forming the element accommodation part (430) is not limited tofour (431, 432, 433, 434).

The element accommodation part (430) may include a first accommodationpart (431) disposed at one side of the image sensor (200). The elementaccommodation part (430) may include, at one side of the image sensor(200), a second accommodation part (432) disposed by being spaced apartfrom the first accommodation part (431). The element accommodation part(430) may include a third accommodation part (433) disposed at the otherside of the image sensor (200). That is, the third accommodation part(433) may be disposed at a position opposite to the first accommodationpart (431). The element accommodation part (430) may include a fourthaccommodation part (434) disposed at the other side of the image sensor(200) by being spaced apart from the third accommodation part (433).

The first and second accommodation parts (431, 432) may be disposed atone side of the image sensor (200). The third and fourth accommodationparts (433, 434) may be disposed at the other side of the image sensor(200). The first and second accommodation parts (431, 432) may be spacedapart by the first base (400). The third and fourth accommodation parts(433, 434) may be spaced apart by the first base (400).

Each of the first to fourth accommodation parts (431, 432, 433, 434) mayaccommodate at least one circuit element. The first accommodation part(431) may accommodate first and second circuit elements (801, 802).Furthermore, the first accommodation part (431) may accommodate three ormore circuit elements.

The second accommodation part (432) may accommodate third and fourthcircuit elements (803, 804). Furthermore, the second accommodation part(432) may accommodate three or more circuit elements. The third andfourth accommodation parts (433, 434) may be also applied with thedescription of the first and second accommodation parts (431, 432).

The lens module (500) may be disposed at an upper side of the imagesensor (200). The filter (600) may be interposed between the lens module(500) and the image sensor (200). The lens module (500) may be disposedat an inside of the cover member (7100). The lens module (500) may befixed to the first base (400).

The lens module (500) may include at least one lens (not shown). Thelens module (500) may include a lens and a lens barrel. The lens module(500) may include at least one lens and a lens barrel accommodating atleast one lens. However, the configuration of the lens module (500) isnot limited to a lens barrel, and any configuration of holder structuresupportable of at least one lens may be allowable. The lens module (500)may be screw-connected to a bobbin (not shown). Alternatively, the lensmodule (500) may be coupled to a bobbin (not shown) using an adhesive. Alight having passed the lens module (500) may be irradiated on an imagesensor (200).

The filter (600) may be disposed between the lens module (500) and theimage sensor (200). The filter (600) may be supported at a part of abottom surface thereof by the first support unit (411). A lateralsurface of the filter (600) may face a second support unit (412). Aheight of the filter (600) may correspond to a height of the secondsupport unit (412). The filter (600) may be spaced apart from the imagesensor (200). The filter (600) may be spaced apart from the currentcarrying part (300).

The filter (600) may prevent a light of IR (Infrared) region from beingincident on the image sensor (200). The filter (600) may include an IRabsorption filter (blue filter). The filter (600) may include an IRreflection filter (IR cut filter). The filter (600) may be formed with afilm material or a glass material. The filter (600) may be formed bycoating an IR cut-off coating material on an optical filter of flat typesuch as imaging surface protection cover glass or a cover glass.However, the present disclosure is not limited thereto.

The lens driving unit (700) may include a cover member (7100), a firstrotor (7200), a second rotor (7300), a stator (7400), a second base(7500), a support member (7600) and a sensor part (7700). However, thelens driving unit (700) according to a first exemplary embodiment of thepresent disclosure may omit one or more elements from the cover member(7100), the first rotor (7200), the second rotor (7300), the stator(7400), the second base (7500), the support member (7600) and the sensorpart (7700). Particularly, the sensor part (7700) may be omitted fromconfiguration of the lens driving unit (700), because the sensor part(7700) is a configuration for auto focus feedback function and/orhandshake correction feedback function.

The cover member (7100) may form an external shape of the lens drivingunit (700). The cover member (7100) may take a shape of a hexahedronopened at a bottom surface. However, the present disclosure is notlimited thereto. The cover member (7100) may include an upper plate(7101) and a lateral plate (7102) extended from an outside of the upperplate (7101) to a bottom side. Meantime, a bottom end of the lateralplate (7102) of the cover member (7100) may be mounted on the secondbase (7500). An inner space formed by the cover member (7100) and thesecond base (7500) may be disposed with a first rotor (7200), a secondrotor (7300), a stator (7400) and a support member (7600). Furthermore,the cover member (7100) may be mounted on the second base (7500) bybeing tightly contacted at an inner lateral surface to a part or a wholearea of lateral surface of the second base (7500). The cover member(7100) can perform the functions of protecting an inner constituentelements and preventing foreign objects from penetrating to an inside.

The cover member (7100) may be formed with a metal material, forexample. To be more specific, the cover member (7100) may be formed witha metal plate. In this case, the cover member (7100) can block electricwave interference. That is, the cover member (7100) can block theelectric wave generated from outside of the lens driving unit (700) fromentering an inside of the cover member (7100). Furthermore, the covermember (7100) can block the electric wave generated from inside of thecover member (7100) from emitting to the outside of the cover member(7100). However, the material of cover member (7100) is not limited tothe metal material, or metal plate.

The cover member (7100) may include an opening (7110) formed at an upperplate (7101) to expose the lens module (500). The opening (7110) may beformed in a shape corresponding to that of the lens module (500). Thesize of the opening (7110) may be formed greater than a diameter of thelens module (500) to allow the lens module (500) to be assembled throughthe opening (7110). Furthermore, a light introduced through the opening(7110) may pass through the lens module (500). Meantime, the lighthaving passed the lens module (500) may be transmitted to the imagesensor.

The first rotor (7200) may be coupled with the lens module (500). Thelens module (500) may be disposed at an inside of the first rotor(7200). An inner surface of the first rotor (7200) may be coupled withan external circumferential surface of the lens module (500). Meantime,the first rotor (7200) may integrally move with the lens module (500)through an interaction with a second rotor (7300). That is, the firstrotor (7200) can move the lens module (500).

The first rotor (7200) may include a bobbin (7210) and an AF coil part(7220). The first rotor (7200) may include a bobbin (7210) that iscoupled with the lens module (500). The first rotor (7200) may includean AF coil part (7220) disposed at the bobbin (7210) to be moved byelectromagnetic interaction with a driving magnet part (7320).

The bobbin (7210) may be coupled with the lens module (500). To be morespecific, the bobbin (7210) may be coupled at an inner circumferentialsurface by the external circumferential surface of the lens module(500). Meantime, the bobbin (7210) may be coupled with the AF coil part(7220). Furthermore, the bobbin (7210) may be coupled at a bottomsurface with a bottom support member (7620) and may be coupled at anupper surface with an upper support member (7610). The bobbin (7210) maybe disposed at an inside of a housing (7310). The bobbin (7210) mayrelatively move to an optical axis direction relative to the housing(7310).

The bobbin (7210) may include a lens coupling part (7211) formed at aninside thereof. The lens coupling part (7211) may be coupled by the lensmodule (500). An inner circumferential surface of the lens coupling part(7211) may be formed with a screw thread having a shape corresponding tothat of a screw thread formed at the external circumferential surface ofthe lens module (500). That is, an inner circumferential surface of thelens coupling part (7211) may be screw-connected by the externalcircumferential surface of the lens module (500). Meantime, an adhesivemay be injected between the lens module (500) and the bobbin (7210). Atthis time, the adhesive may be an epoxy that is cured (hardened) by UV(Ultraviolet). That is, the lens module (500) and the bobbin (7210) maybe adhered by UV-curing epoxy. Alternatively, the lens module (500) andthe bobbin (7210) may be adhered by heat-curing epoxy.

The bobbin (7210) may include a first driving part coupling part (7212)wound or mounted with an AF coil part (7220). The first driving partcoupling part (7212) may be integrally formed with an external lateralsurface of the bobbin (7210). Furthermore, the first driving partcoupling part (7212) may be continuously formed along the externallateral surface of the bobbin (7210) or formed by being spaced apart ata predetermined distance. The first driving part coupling part (7212)may include an indent part formed by a part of the external lateralsurface of the bobbin (7210) being caved in. The indent part may bedisposed with an AF coil part (7220), where the AF coil part (7220) maybe supported by the first driving part coupling part (7212).

By way of example, the first driving part coupling part (7212) may beformed by parts protruded at upper and bottom sides of the indent partbeing disposed, where a coil of the first driving part (7300) may bedirectly wound on the indent part of the first driving part couplingpart (7212). Alternatively, by way of another example, the first drivingpart coupling part (7212) may take a shape of upper side or a bottomside of the indent part being opened, and formed at the other side bybeing disposed with a hitching part, where the coil of the first drivingpart (7300) may be coupled by being inserted through the opened partwhile the coil is in a pre-wound state.

The bobbin (7210) may include an upper coupling part (7213) coupled toan upper support member (7610). The upper coupling part (7213) may becoupled to an inner lateral part (7612) of the upper support member(7610). For example, a lug (not shown) of the upper coupling part (7213)may be coupled by being inserted into a groove or a hole of the innerlateral part (7612).

The bobbin (7210) may include a bottom coupling part (not shown) coupledto a bottom support member (7620). The bottom coupling part formed at abottom surface of the bobbin (7210) may be coupled with an inner lateralpart (7622) of the bottom support member (7620). For example, a lug (notshown) of the bottom coupling part may be coupled by being inserted intoa groove or a hole of the inner lateral part (7622).

The AF coil part (7220) may be disposed by facing or being opposite to adriving magnet part (7320) of a second rotor (7300). The AF coil part(7220) may move the bobbin (7210) through an electromagnetic interactionwith the driving magnet part (7320) relative to the housing (7310). TheAF coil part (7220) may include a coil. The coil may be guided by thefirst driving part coupling part (7212) to be wound on the externallateral surface of the bobbin (7210). Furthermore, by way of anotherexample, the AF coil part (7220) may be arranged at the external lateralsurface of the bobbin (7210) to allow four independent coils to bedisposed and to allow two adjacent coils to form an angle of 90°therebetween.

The AF coil part (7220) may receive an electric power through the bottomsupport member (7620). At this time, the bottom support member (7620)may be divisably formed in a pair in order to supply the electric powerto the AF coil part (7220). Meantime, the AF coil part (7220) mayinclude a pair of leader lines (not shown) in order to supply theelectric power to the AF coil part (7220). In this case, each of thepair of leader lines on the AF coil part (7220) may be electricallycoupled to a pair of bottom support members (7620 a, 7620 b).Alternatively, the AF coil part (7220) may receive the electric powerfrom the upper support member (7610).

Meantime, the AF coil part (7220) may be formed at a surrounding with anelectromagnetic field when the power is supplied to the AF coil part(7220). By way of another example, the AF coil part (7220) and thedriving magnet part (7320) may be so arranged as to exchange theirpositions.

The second rotor (7300) may be disposed opposite to the first rotor(7200) at an external side of the first rotor (7200). The second rotor(7300) may be supported by a second base (7500) disposed at a bottomsurface thereof. The second rotor (7300) may be supported by a fixedmember. At this time, the fixed member may include the second base(7500) and a stator (7400). That is, the second rotor (7300) may besupported by the second base (7500) and/or the stator (7400). The secondrotor (7300) may be disposed at an inner space of the cover member(7100).

The second rotor (7300) may include a housing (7310) and a drivingmagnet part (7320). The second rotor (7300) may include a housing (7310)disposed at an outside of the bobbin (7210). Furthermore, the secondrotor (7300) may be disposed opposite to the AF coil part (7220) toinclude a driving magnet part (7320) fixed to the housing (7310).

At least one part of the housing (7310) may be formed with a shapecorresponding to that of an inner lateral surface of the cover member(7100).

Inter alia, an external lateral surface of the housing (7310) may beformed with a shape corresponding to an inner lateral surface of alateral plate (7102) of the cover member (7100). The external lateralsurface of the housing (7310) and the inner lateral surface of thelateral plate (7102) may be flatly formed. To be more specific, when thehousing is at an initial position, the external lateral surface of thehousing (7310) and the inner lateral surface of the lateral plate (7102)may be flatly formed.

In this case, when the housing (7310) is moved maximally to a covermember (7100) side, the external lateral surface of the housing (7310)and the inner lateral surface of the lateral plate (7102) maysurface-contact to disperse a shock generated from the housing (7310)and/or the cover member (7100). The housing (7310) may take a shape of ahexahedron including four lateral surfaces, for example. However, theshape of the housing (7310) may take any shape as long as the housing isarranged inside the cover member (7100). The housing (7100) may becoupled at an upper surface with the upper support member (7610), andmay be coupled at a bottom surface with the bottom support member(7620).

The housing (7310) may be formed with an insulating material, and may beformed with an injection-molded material in consideration ofproductivity. The housing (7310) is a moving part for ON driving, andmay be spaced apart from the cover member (7100) at a predeterminedistance. However, in case of AF model, the housing (7310) may be fixedon the second base (7500). Furthermore, the housing (7310) may beomitted in case of the AF model, and the driving magnet part (7320) maybe fixed on the cover member (7100).

The housing (7310) may be opened at an upper side and a bottom side tomovably accommodate the first rotor (7200) to a vertical direction. Thehousing (7310) may include an upper/bottom opened inner space (7311) atan inside of the housing (7310). The inner space (7311) may be movablydisposed therein with a bobbin (7210). That is, the inner space (7311)may take a shape corresponding to that of the bobbin (7210).Furthermore, an inner circumferential surface of the housing (7310)forming the inner space (7311) may be spaced apart from the externalcircumferential surface of the bobbin (7210). The housing (7310) may bemovably supported relative to the second base (7500). That is, thehousing (7310) may be moved or tilted to a horizontal direction based onsecond base (7500).

The housing (7310) may include a second driving part coupling part(7312) formed at a lateral surface with a shape corresponding to that ofthe driving magnet part (7320) to accommodate the driving magnet part(7320). That is, the second driving part coupling part (7312) may befixed by accommodating the driving magnet part (7320). The drivingmagnet part (7320) may be fixed to the second driving part coupling part(7312) by an adhesive (not shown). Meantime, the second driving partcoupling part (7312) may be disposed at an inner lateral part of housing(7310), which is advantageous to the electromagnetic interaction withthe AF coil part (7220) disposed at an inside of the driving magnet part(7320). Furthermore, the second driving part coupling part (7312) may beopened at a bottom surface, for example, which is advantageous to theelectromagnetic interaction between a substrate (7420) disposed at abottom side of the driving magnet part (7320) and the driving magnetpart (7320). By way of example, a bottom end of the driving magnet part(7320) may be so disposed as to allow more protruding downward than abottom end of the housing (7310). The second driving part coupling part(7312) may be formed in the number of four (4), for example. Each of thesecond driving part coupling part (7312) may be coupled by the drivingmagnet part (7320).

The housing (7310) may include an upper coupling part (7313) coupledwith the upper support member (7610). The upper coupling part (7313) maybe coupled to an external lateral part (7611) of the upper supportmember (7610). By way of example, a lug of the upper coupling part(7313) may be coupled by being inserted into a groove or a hole (notshown) of the external lateral part (7611).

The housing (7310) may include a bottom coupling part (not shown)coupled to the bottom support member (7620). The bottom coupling partformed at a bottom surface of the housing (7310) may be coupled to anexternal lateral part (7621) of the bottom support member (7620). By wayof example, a lug of the bottom coupling part may be coupled by beinginserted into a groove or a hole (not shown) of the external lateralpart (7621).

The housing (7310) may include a first lateral surface, a second lateralsurface adjacent to the first lateral surface and a corner part disposedbetween the first and second lateral surfaces. The corner part of thehousing (7310) may be disposed with an upper stopper (not shown). Theupper stopper may be overlapped with the cover member (7100) to avertical direction. When the housing (7310) is moved upward by anexternal shock, the upper stopper may restrict an upward movement of thehousing by being contacted to the cover member (7100).

The driving magnet part (7320) may be disposed opposite to the AF coilpart (7220) of the first rotor (7200). The driving magnet part (7320)may move the AF coil part (7220) through the electromagnetic interactionwith the AF coil part (7220). The driving magnet part (7320) may includea magnet. The magnet may be fixed to the second driving part couplingpart (7312). The driving magnet part (7320) may be arranged at thehousing (7310) to allow four independent magnets to be disposed and toallow two adjacent magnets to form an angle of 90° therebetween, asillustrated in FIG. 2.

That is, the driving magnet part (7320) may be mounted at four lateralsurfaces of the housing (7310) each at an equidistance, to promote anefficient use of an inner volume. Furthermore, the driving magnet part(7320) may be adhered to the housing (7310) using an adhesive, but thepresent disclosure is not limited thereto.

The stator (7400) may be disposed at the second base (7500). The stator(7400) may be disposed opposite to a bottom side of the second rotor(7300). The stator (7400) may movably support the second rotor (7300).The stator (7400) may move the second rotor (7300). The stator (7400)may be disposed at a center with a through hole (7421) corresponding tothe lens module (500). Because the stator (7400) may be formed with aterminal part (7430) to directly communicate with the outside accordingto the first exemplary embodiment of the present disclosure, there isrequired no separate FPCB. Thus, the first exemplary embodiment of thepresent disclosure may expect a cost reduction effect because the numberof parts, the number of procedures and a reduced process managementpoint over a model that is separately mounted with an FPCB and a patterncoil. Furthermore, the entire height of the product is reduced tocontribute to the miniaturization of the product.

The stator (7400) may include an OIS coil part (7410) and a substrate(7420), for example. The stator (7400) may include an OIS coil part(7410) arranged at the substrate (7420). The stator (7400) may include asubstrate (7420) accommodated at the second base (7500) by beingdisposed opposite to a bottom side of the driving magnet part (7320).The stator (7400) may include a terminal part (7430) extended by beingbent from the substrate (7420) to a bottom side.

The OIS coil part (7410) may face the driving magnet part (7320). TheOIS driving coil part (7410) may move the driving magnet part (7320)through an electromagnetic interaction. When a power is applied to theOIS coil part (7410), the driving magnet part (7320) and the housing(7310) fixed by the driving magnet part (7320) may integrally movethrough an electromagnetic interaction with the driving magnet part(7320). The OIS coil part (7410) may be mounted on the substrate (7420),electrically connected to the substrate (7420) or integrally formed withthe substrate (7420). The OIS coil part (7410) may be an FP (FinePattern) coil, for example, and may be arranged, mounted or formed atthe substrate (7420). The OIS coil part (7410) may be so formed as tominimize an interference with an OIS sensor (7720) disposed at a bottomside, for example. The OIS coil part (7410) may be so formed as not tooverlap with the OIS sensor (7720) to a vertical direction. The ONsensor (7720) may be so mounted at a bottom side of the stator (7400) asto prevent overlap with the OIS coil part (7410) to a verticaldirection. The OIS coil part (7410) may be arranged by being changed inposition with the driving magnet part (7320).

The substrate (7420) may be accommodated on the second base (7500).Meantime, the substrate (7420) can supply an electric power to the AFcoil part (7220). By way of example, the substrate (7420) can supply thepower to the AF coil part (7220) through a lateral support member(7630), an upper support member (7610), a current carrying member (7640)and a bottom support member (7620). Alternatively, the substrate (7420)can supply the power to the AF coil part (7220) through the lateralsupport member (7630) and the upper support member (7610).

The substrate (7420) may support from a bottom side in order to move ortilt the housing (7310) to a horizontal direction. The substrate (7420)may be coupled with the housing (7310) through the lateral supportmember (7630). The substrate (7420) may be disposed with an OIS sensor(7720) detecting a position or movement of the housing (7310). Thesubstrate (7420) may be disposed at an upper surface with the OIS coilpart (7410), and may be disposed at a bottom surface with the OIS sensor(7720).

The substrate (7420) may include a through hole (7421). The substrate(7420) may include a through hole (7421) allowing a light having passedthe lens module (500) to pass therethrough. The through hole (7421) maybe formed at a center of the substrate (7420). The through hole (7421)may be formed with a round shape, but the present disclosure is notlimited thereto.

The terminal part (7430) may be connected to an outside electric powersource through which the substrate (7420) is supplied with the power.The terminal part (7430) may be formed by being extended from a lateralside of the substrate (7420). The terminal part (7430) may be disposedat both sides of the substrate (7420). The substrate (7420) and theterminal part (7430) may be integrally formed. The terminal part (7430)may be accommodated in to a terminal accommodation part (7540) formed bya part of a lateral surface of the second base (7500) being caved in.The terminal accommodation part (7540) may be formed with a widthcorresponding to that of the terminal part (7430).

The second base (7500) may support the second rotor (7300). The secondbase (7500) may be disposed at a bottom side with the first base (400).Meantime, any one of the first and second bases (400, 7500) may beomitted, and the first and second bases (400, 7500) may be integrallyformed. The second base (7500) may include a through hole (7510) formedat a position corresponding to that of the lens coupling part (7211) ofthe bobbin (7210). The second base (7500) may include a foreign objectcollection part (7520) collecting foreign objects introduced into thecover member (7100), for example. The foreign object collection part(7520) may be disposed at a position at an upper surface of the secondbase (7500) to collect foreign objects including an adhesive materialand a foreign object at an inside space formed by the cover member(7100) and the second base (7500).

The second base (7500) may include a sensor part accommodation groove(7530) coupled by the OIS sensor (7720). That is, the OIS sensor (7720)may be mounted on the sensor part accommodation groove (7530). At thistime, the OIS sensor (7720) may detect a horizontal movement or tilt ofthe housing (7310) by detecting the driving magnet part (7320) coupledto the housing (7310). The sensor part accommodation groove (7530) maybe formed in the number of two (2), for example. Each of the sensor partaccommodation groove (7530) may be disposed with the OIS sensor (7720).In this case, the OIS sensor (7720) may be so arranged as to detect bothx axis direction movement and y axis direction movement of the housing(7310). That is, an imaginary line connecting each of the two OISsensors (7720) and the optical axis may cross at a right angle.

The support member (7600) may connect two or more of the first rotor(7200), the second rotor (7300), the stator (7400) and the second base(7500). The support member (7600) may elastically connect two or more ofthe first rotor (7200), the second rotor (7300), the stator (7400) andthe second base (7500) to enable a relative movement between eachelement. The support member (7600) may be formed with an elastic member.The support member (7600) may include an upper support member (7610), abottom support member (7620), a lateral support member (7630) and acurrent carrying member (7640), for example. However, the currentcarrying member (7640) is disposed to carry a current for the uppersupport member (7610) and the bottom support member (7620), such thatthe current carrying member (7640) may be explained by being separatedfrom the upper support member (7610), the bottom support member (7620),and the lateral support member (7630).

The upper support member (7610) may include an external part (7611), aninternal part (7612) and a connection part (7613), for example. Theupper support member (7610) may include an external part (7611) coupledto the housing (7310), an internal part (7612) coupled to the bobbin(7210) and a connection part (7613) elastically connecting the externalpart (7611) and the internal part (7612).

The upper support member (7610) may be connected to an upper surface ofthe first rotor (7200) and an upper surface of the second rotor (7300).To be more specific, the upper support member (7610) may be coupled toan upper surface of the bobbin (7210) and to an upper surface of thehousing (7310). The internal part (7612) of the upper support member(7610) may be coupled to an upper lateral coupling part (7213) of thebobbin (7210), and the external part (7611) of the upper support member(7610) may be coupled to an upper lateral coupling part (7313) of thehousing (7310).

The upper support member (7610) may be divisibly formed with six (6)upper current carrying parts, for example. At this time, the two (2)upper current carrying parts in the six current carrying parts may beelectrically connected to be used for applying an electric power to theAF coil part (7220). Each of the two upper current carrying parts may beelectrically connected to each of a pair of bottom support members (7620a, 620 b) through a current carrying member (7640). The remaining four(4) upper current carrying parts of the six upper current carrying partsmay be electrically connected to the AF sensor part (7710) disposed atthe bobbin (7210). The remaining four (4) upper current carrying partsmay supply an electric power to the AF sensor part (7710) and may beused for receipt and transmission of information and signals between acontroller and the AF sensor part (7710). Furthermore, as amodification, the two upper current carrying parts of the six uppercurrent carrying parts may be directly connected to the AF coil part(7220) and the remaining four upper current carrying parts may beconnected to the AF sensor part (7710).

The bottom support member (7620) may include a pair of bottom supportmembers (7620 a, 620 b), for example. That is, the bottom support member(7620) may include a first bottom support member (7620 a) and a secondbottom support member (7620 b). At this time, the bottom support member(7620) may be explained as including two bottom current carrying parts.Each of the first bottom support member (7620 a) and the second bottomsupport member (7620 b) can supply an electric power by being connectedto each of a pair of leader lines on the AF coil part (7220) formed by acoil. Meantime, the pair of bottom support members (7620 a, 620 b) maybe electrically connected to the OIS coil part (7410). Through this typeof structure, the pair of bottom support members (7620) can provide theelectric power supplied from the OIS coil part (7410) to the AF coilpart (7220).

The bottom support member (7620) may include an external part (7621), aninternal part (7622) and a connection part (7623). The bottom supportmember (7620) may include an external part (7621) coupled to the housing(7310), an internal part (7622) coupled to the bobbin (7210) and aconnection part (7623) elastically connecting the external part (7621)and the internal part (7622).

The bottom support member (7620) may be connected to a bottom surface ofthe first rotor (7200) and to a bottom surface of the second rotor(7300). To be more specific, the bottom support member (7620) may beconnected to a bottom surface of the bobbin (7210) and to a bottomsurface of the housing (7310). The internal part (7622) of the bottomsupport member (7620) may be coupled with a bottom coupling part of thebobbin (7210), and the external part (7621) of the bottom support member(7620) may be coupled with a bottom coupling part of the housing (7310).

The lateral support member (7630) may be coupled at one side to thestator (7400) and/or to the second base (7500), and may be coupled atthe other side to the upper support member (7610) and/or to the secondrotor (7300). The lateral support member (7630) may be coupled at oneside to the stator (7400) and may be coupled at the other side to thehousing (7310), for example. Furthermore, by way of another example, thelateral support member (7630) may be coupled at one side to the secondbase (7500) and may be coupled at the other side to the upper supportmember (7610). As noted above, the lateral support member (7630) mayelastically support the second rotor (7300) to allow the second rotor(7300) to horizontally move or tilt relative to the second base (7500).

The lateral support member (7630) may include a plurality of wires.Furthermore, the lateral support member (7630) may include a pluralityof leaf springs. The lateral support member (7630) may be formed withthe same number as that of the upper support member (7610), for example.That is, the lateral support member (7630) may be divided to six (6) tobe respectively connected to the upper support members (7610) that aredivided to six pieces. In this case, the lateral support member (7630)can supply an electric power supplied from the stator (7400) or fromoutside to each of the upper support members (7610). The number oflateral support member (7630) may be determined in consideration ofsymmetry, for example. A total of eight (8) lateral support members(7630), two-member each at a corner of the housing (7310), may beformed, for example.

The lateral support member (7630) or the upper support member (7610) mayinclude a shock absorption part (not shown) in order to absorb a shock,for example. The shock absorption part may be disposed on at least anyone of the lateral support member (7630) and the upper support member(7610). The shock absorption part may be a separate member like adamper. Furthermore, the shock absorption part may be realized by changein shape to more than one part of any one of the lateral support member(7630) and the upper support member (7610).

The current carrying member (7640) may electrically connect the uppersupport member (7610) and the bottom support member (7620). The currentcarrying member (7640) may be separately formed from the lateral supportmember (7630). The power supplied to the upper support member (7610)through the current carrying member (7640) may be supplied to the bottomsupport member (7620), and the power may be supplied to the AF coil part(7220) through the bottom support member (7620). Meantime, as amodification, when the upper support member (7610) is directly connectedto the AF coil part (7220), the current carrying member (7640) may beomitted.

The sensor part (7700) may be used for any one of auto focus feedbackand handshake correction feedback. The sensor part (7700) may detect anyone of position or movement of the first rotor (7200) and second rotor(7300). The sensor part (7700) may include an AF sensor part (7710) andan OIS sensor (7720), for example. The AF sensor part (7710) can provideinformation for AF feedback by sensing a relative vertical movement ofthe bobbin (7210) relative to the housing (7310). The OIS sensor (7720)can provide information for OIS feedback by detecting a horizontalmovement or a tilt of the second rotor (7300).

The AF sensor part (7710) may be disposed at the first rotor (7200). TheAF sensor part (7710) may be fixed by being inserted into a sensor guidegroove (not shown) formed at an external circumferential surface of thebobbin (7210). The AF sensor part (7710) may include a first sensor(7711), a flexible FPCB (7712) and a terminal part (7713), for example.

The first sensor (7711) may detect a movement or a position of thebobbin (7210). Alternatively, the first sensor (7711) may detect aposition of the driving magnet part (7320) mounted on the housing(7310). The first sensor (7711) may be a Hall sensor, for example. Inthis case, the first sensor (7711) may detect a relative position changebetween the bobbin (7210) and the housing (7310) by detecting a magneticforce generated from the driving magnet part (7320). The flexible PCB(7712) may be mounted with a first sensor (7711). The flexible PCB(7712) may be formed with a strip shape, for example. At least a part ofthe flexible PCB (7712) may be inserted into a sensor guide groove bybeing formed with a shape corresponding to the sensor guide grooveconcavely formed at an upper surface of the bobbin (7210). The flexiblePCB (7712) may be an FPCB. That is, the flexible PCB (7712) may beflexibly formed and bent in order to correspond to the sensor guidegroove in terms of shape. The flexible P CB (7712) may be formed with aterminal part (7713).

The terminal part (7713) may supply an electric power to the firstsensor (7711) through the flexible PCB (7712) by receiving the power.Furthermore, the terminal part (7713) may receive a control commandrelative to the first sensor (7711) or transmit a value sensed from thefirst sensor (7711). The terminal part (7713) may be provided in thenumber of four (4), and may be electrically connected to the uppersupport member (7610). In this case, two terminal parts (7713) may beused for receiving a power from the upper support member (7610), and theremaining two terminal parts (7713) may be used for receiving ortransmitting information or a signal.

The OIS sensor (7720) may be disposed at the stator (7400). The OISsensor (7720) may be disposed at an upper surface or a bottom surface ofthe OIS coil part (7410). The OIS sensor (7720) may be disposed at asensor part accommodation groove (7530) formed at the second base (7500)by being arranged at a bottom surface of the OIS coil part (7410), forexample. The OIS sensor (7720) may be a Hall sensor, for example. Inthis case, the OIS sensor (7720) can sense a relative movement of thesecond rotor (7300) relative to the stator (7400) by sensing a magneticfield of the driving magnet part (7320). The Hall sensor may be mountedon the substrate (7420) through the SMT (Surface Mounting Technology).The OIS sensor (7720) can detect both x axis and y axis movements of thesecond rotor (7300) by being formed in the number of more than two.

The circuit element unit (800) may be mounted on a circuit substrate(100). The circuit element unit (800) may be disposed at an elementaccommodation part (430) of the first base (400). The circuit elementunit (800) may be opened at an upper side. The circuit element unit(800) may not be overlapped with the first base (400) to the opticalaxis direction. That is, the circuit element unit (800) may be exposedto an upper side.

The circuit element unit (800) may include a plurality of circuitelements each spaced apart from the other element. The circuit elementunit (800) may include first to fourth circuit elements (801, 802, 803,804), each spaced apart from the other. The first to fourth circuitelements (801, 802, 803, 804) may be accommodated in one accommodationpart forming the element accommodation part (430) and may be divisiblyaccommodated in a plurality of accommodation parts.

Hereinafter, the effect of camera module according to the firstexemplary embodiment of the present disclosure will be described withreference to FIG. 7.

FIG. 7 is a cross-sectional view illustrating a camera module accordingto (a) a comparative example and (b) an exemplary embodiment of thepresent disclosure in order to explain an effect of a first exemplaryembodiment of the present disclosure.

Referring to FIG. 7(a), it can be ascertained from FIG. 7(a) that afirst base (400) of mold material supporting a filter (600) is existentat an upper side of the current carrying part (300) in the camera moduleaccording to the comparative example. In the case of comparativeexample, an FBI (L1), a distance from an upper surface of the imagesensor of the camera module to a bottom surface of the lens module(500), is increased due to thickness of the first base (400).

Furthermore, it can be ascertained from the camera module according tothe comparative example that the first base (400) is existent at anupper side of the circuit element unit (800). In the case of comparativeexample, a height of a bottom end surface of the lens driving unit (700)supported by the cover member support part (420) is increased due tothickness of the cover member support part (420) of the first base(400). As a result, a whole length (H1 of FIG. 7) of the camera moduleis also lengthened.

Referring to FIG. 7(b), it can be ascertained the camera moduleaccording to the first exemplary embodiment of the present disclosurethat the injection-molded first base (400) supporting the filter (600)has been escaped to an outside. That is, it can be ascertained that thefirst base (400) is not overlapped with the current carrying part (300)to the optical axis direction in the camera module according to thefirst exemplary embodiment of the present disclosure.

Thus, in comparison with the comparative example, the lens module (500)can be so designed as to reduce the FBL as much as the injection-moldedmaterial supporting the filter (600) in the first exemplary embodimentof the present disclosure. That is, an FBL (L2), a distance from anupper surface of the image sensor (200) to a bottom surface of the lensmodule (500), can be minimized through the camera module according tothe first exemplary embodiment of the present disclosure. Furthermore,an entire length of the camera module can be minimized because of theminimized FBL.

Meantime, it can be ascertained from the camera module according to thefirst exemplary embodiment of the present disclosure that the thicknessof the cover member support part (420) can be minimized by omitting apart of the first base (400) and by opening a ceiling of the circuitelement unit (800). That is, it can be ascertained from the cameramodule according to the first exemplary embodiment of the presentdisclosure that the first base (400) is prevented from overlapping withthe circuit element unit (800) in the optical axis direction.

Thus, in comparison with the comparative example, a bottom end surfaceof the lens driving unit (700) can be decreased as much as the reducedthickness of the cover member support part (420) according to the firstexemplary embodiment of the present disclosure. Hence, the whole length(H2 of FIG. 7) of the camera module can be minimized according to thefirst exemplary embodiment of the present disclosure.

Hereinafter, a configuration of a camera module according to amodification of the first exemplary embodiment of the present disclosurewill be described with reference to FIG. 8.

FIG. 8 is cross-sectional view illustrating a partial configuration of acamera module according to a modification of a first exemplaryembodiment of the present disclosure.

Referring to FIGS. 5 and 8, the camera module according to themodification in the first exemplary embodiment of the present disclosuremay further comprise an extension part (440) in comparison with thecamera module according to the first exemplary embodiment of the presentdisclosure.

The extension part (440) can connect a filter support part (410) to acover member support part (420). The extension part (440) may beintegrally formed with the filter support part (410) and the covermember support part (420). The extension part (440) may be disposed atan upper side of the circuit element unit (800) mounted on the circuitboard (100).

The camera module according to the modification in the first exemplaryembodiment of the present disclosure may further comprise an indent part(450) in comparison with the camera module according to the firstexemplary embodiment of the present disclosure. The indent part (450)may be formed by indentation of at least one part of an upper surface ofthe cover member support part (420).

Meantime, the element accommodation part (430) in the modification maynot pass through the first base (400) in the optical axis direction.That is, the element accommodation part (430) in the modification may bea groove where a part of a bottom surface of the first base (400) isupwardly indented.

Although the circuit element unit (800) mounted on the circuit board(100) is exposed to an upper side in the camera module according to thefirst exemplary embodiment of the present disclosure, the circuitelement unit (800) mounted on the circuit board (100) may not be exposedin the modification of the camera module according to the firstexemplary embodiment of the present disclosure. Thus, the modificationhas an advantageous effect over the first exemplary embodiment in thatthe foreign objects are prevented from entering the circuit element unit(800) through the upper side to thereby protect the circuit element unit(800). However, the first exemplary embodiment of the present disclosuremay be advantageous over the modification in that a whole length to theoptical axis direction of the camera module may be further shortenedbecause the length in the optical axis direction in a structuresupporting the cover member (700) is shorter than that in themodification.

Hereinafter, a configuration of a camera module according to a secondexemplary embodiment of the present disclosure will be described withreference to accompanying drawings.

FIG. 9 is a perspective view of a camera module according to a secondexemplary embodiment of the present disclosure,

FIG. 10 is an exploded perspective view of a camera module according toa second exemplary embodiment of the present disclosure, FIG. 11 is aperspective view of a sensor base according to a second exemplaryembodiment of the present disclosure, FIG. 12 is a plane view of asensor base according to a second exemplary embodiment of the presentdisclosure, and FIG. 13 is a lateral view of a sensor base according toa second exemplary embodiment of the present disclosure.

The camera module may include a circuit board (1100), an image sensor(1200), a sensor base (1300), a lens driving unit (1400), an adhesivemember (1500), a filter (1600), and a lens module (1700). However, anyone or more of the circuit board (1100), the image sensor (1200), thesensor base (1300), the lens driving unit (1400), the adhesive member(1500), the filter (1600), and the lens module (1700) may be omitted.Meantime, the camera module may further include a lens protection tape(1810), an insulation tape (1820) and a connector (1830).

The circuit board (1100) may be disposed with an image sensor (1200).The circuit board (1100) may be disposed at an upper surface with theimage sensor (1200). The sensor base (1300) may be 3 disposed at anupper surface of the circuit board (1100).

The circuit board (1100) may support the sensor base (1300). The circuitboard (1100) may be disposed at an inner side of the upper surface withthe image sensor (1200), and may be disposed at an outside of an uppersurface thereof with the sensor base (1300). The circuit board (100) maybe disposed at an outside of upper surface thereof with the sensor base(1300). The sensor base (1300) may be disposed at an upper side with alens driving unit (1400).

Through this structure, a light having passed the lens module (1700)accommodated at an inside of the lens driving unit (1400) may beirradiated on the image sensor (1200) mounted on the circuit board(1100). The circuit board (1100) can supply an electric power to thelens driving unit (1400). Meantime, the circuit board (1100) may bedisposed with a controller (not shown) in order to control the lensdriving unit (1400).

The controller may control a direction, intensity and an amplitude of acurrent supplied to each of the elements forming the lens driving unit(1400). The controller may perform at least any one of autofocusfunction and handshake correction function of a camera module bycontrolling the lens driving unit (1400). That is, the controller canmove or tilt the lens module to an optical axis direction or to adirection vertical to the optical axis direction by controlling the lensdriving unit (1400).

Furthermore, the controller can perform the feedback control ofautofocus function and handshake correction function. To be morespecific, the controller can control the power or the current applied tothe AF coil part (not shown) and/or the ON coil par (not shown) byreceiving a position of the lens module (1700) detected by the sensorpart (not shown), whereby a more accurate autofocus function andhandshake correction function can be provided.

The image sensor (1200) may be disposed at an upper surface of thecircuit board (1100). The image sensor (1200) may be mounted on thecircuit board (1100). The image sensor (1200) may be accommodated at aninside of the sensor base (1300). The image sensor (1200) may bedisposed at a bottom side of a through hole (1320) of the sensor base(1300). The image sensor (1200) may be disposed at a bottom side of thefilter (1600). The image sensor (1200) may be so disposed as to conformto the lens module (1700) in terms of optical axis, whereby the imagesensor (1200) can obtain a light having passed the lens module (1700).The image sensor (1200) may include any one or more than any one of aCCD (Charged Coupled Device), a MOS (Metal Oxide Semi-Conductor), a CPDand a OD. However, the present disclosure is not limited thereto.

The sensor base (1300) may be disposed at an upper surface of thecircuit board (1100). The sensor base (1300) may be disposed at aninside of the image sensor (1200). The sensor base (1300) may be coupledat an upper side with the lens driving unit (1400).

The sensor base (1300) may include a first external surface (1301), asecond external surface (1302) adjacent to the first external surface(1301) and a first corner part (1305) interposed between the first andsecond external surfaces (1301, 1302). The sensor base (1300) mayinclude continuously adjacent first to fourth external surfaces (1301,1302, 1303, 1304). The sensor base (1300) may include a first externalsurface (1301) adjacent to the second and fourth external surfaces(1302, 1304).

The sensor base (1300) may include a second external surface (1302)adjacent to the first and third external surfaces (1301, 1303). Thesensor base (1300) may include a third external surface (1303) adjacentto the fourth and second external surfaces (1304, 1302). The sensor base(1300) may include a fourth external surface (1304) adjacent to thefirst and third external surfaces (1301, 1303). The sensor base (1300)may include first to fourth corner parts (1305, 1306, 1307, 1308)interposed between the first to fourth external surfaces (1301, 1302,1303, 1304).

The sensor base (1300) may include a first corner part (1305) interposedbetween the first and second external surfaces (1301, 1302). The sensorbase (1300) may include a second corner part (1306) interposed betweenthe second and third external surfaces (1302, 1303). The sensor base(1300) may include a third corner part (1307) interposed between thethird and fourth external surfaces (1303, 1304). The sensor base (1300)may include a fourth corner part (1308) interposed between the fourthand first external surfaces (1304, 1301).

The sensor base (1300) may include a guide part (1310) formed by beingcaved in at a part of an upper surface of the sensor base (1300). Theguide part (1310) may be formed by being caved in to a bottom side at apart of an upper surface of the sensor base (1300). The guide part(1310) may be disposed at the first to fourth corner parts (1305, 1306,1307, 1308) of the sensor base (1300). That is, the guide part (1310)may be respectively disposed at each of four corner parts (1305, 1306,1307, 1308) of the sensor base (1300).

The guide part (1310) may be formed with a chamfer shape. The guide part(1310) may be formed with a shape to broaden an irradiation angle oflight relative to the adhesive member (1500) disposed at an uppersurface of the sensor base (1300) from outside. The guide part (1310)may include a first chamfer part (1315) having a first slope angle. Theguide part (1310) may include a second chamfer part (1316) differentfrom the first slope angle.

At this time, the first slope angle may be an angle formed between (by)an upper surface or a bottom surface of the sensor base (1300) and thefirst chamfer part (1315), and the second slope angle may be an angleformed between (by) an upper surface or a bottom surface of the sensorbase (1300) and the second chamfer part (1316). The first chamfer part(1315) may include a first slope angle. The second chamfer part (1316)may include a second slope angle different from the first slope angle.The first and second chamfer parts (1315, 1316) may be continuouslyarranged from an inside to an outside. Meantime, the second slope anglemay be greater than the first slope angle. The second chamfer part(1316) may be disposed at an outside of the first chamfer part (1315).That is, the guide part (1310) may be formed to have a greater slopeangle toward the outside from the inside.

The guide part (1310) may perform a function of preventing dimensionsfrom going over after adhesive reinforcing work to improve theadhesiveness between the sensor base (1300) and the lens driving unit(1400). To be more specific, because the adhesive coated in response tothe reinforcing work flows to the guide part (1310), the phenomenon maybe reduced in which the adhesive coated in response to the reinforcingwork is protruded to a lateral side of the sensor base (1300) and thelens driving unit (1400).

The guide part (1310) may be determined in its shape in response to adimension relative to a first axis (x axis of FIG. 11) and a second axis(y axis of FIG. 11) arranged in a horizontal direction and to adimension relative to a third axis (z axis of FIG. 11) arranged in avertical direction. At this time, the first, second and third axes mayform a 90° thereamong. The guide part (1310) may be changed in its shapein response to sizes of x, y, z axes. The sensor base (1300) may also bevariably formed from a four-angled shape to a polygonal shape inresponse to the shape of the guide part (1310). By way of example, thesensor base (1300) may be formed approximately with a hexahedron shapein terms of overall external look. That is, the sensor base (1300) maybe of a square shape when viewed from an upper side. However, as amodification, when a size (z axis value) relative to the third axis ofthe guide part (1310) from the first to four corner parts (1305, 1306,1307, 1308) of the sensor base (1300) is increased, a shape of a bottomsurface of the sensor base (1300) attached to the circuit board (1100)may become to look like a pentagonal shape from a previous square shape.In this case, the adhesive force of an adhesive coated in response tothe reinforcing work may be improved while the adhesive flows down to asurface of the circuit board (1100), and the dimensional stability maybe also further secured.

Although the guide part (1310) has been explained as being formed on thesensor base (1300), the guide part (1310) may be formed at the lensdriving unit (1400). That is, the lens driving unit (1400) may be formedat a bottom surface with a guide part (1310) that is caved in to anupper side. At this time, the guide part (1310) may take a chamfershape. However, the present disclosure is not limited thereto, and theguide part (1310) may take any shape as long as a transmission space ofUV light can be secured through the guide part (1310).

The sensor base (1300) may include a through hole (1320) through whichthe sensor base (1300) passes in an optical axis direction. Here, the“optical axis direction” may be interchangeably used with the “verticaldirection”. The through hole (1320) may pass through the sensor base(1300) in a vertical direction. The through hole (1320) may be disposedat an upper side of the image sensor (1200). The through hole (1320) maybe formed by an inner lateral surface of the sensor base (1300). Theinner lateral surface of the sensor base (1300) forming the through hole(1320) may face the first external surface (1301). A length in thevertical direction from a center of the first external surface (1301)may be equal to that of the first internal surface (1321) in thevertical direction. Alternatively, a length in the vertical directionfrom a center of the first external surface (1301) may be longer thanthat of the first internal surface (1321) in the vertical direction.

The sensor base (1300) may include a filter accommodation part (1330)formed by being caved in to a bottom side at a part of the upper surfaceof the sensor base (1300). The filter accommodation part (1330) may beformed by being caved in to a bottom side at a part of the upper surfaceof the sensor base (1300). The filter accommodation part (1330) may beaccommodated with a filter (1600).

The sensor base (1300) may include a substrate accommodation part (1340)accommodating at least a part of a substrate (not shown) of the lensdriving unit (1400). The substrate accommodation part (1340) mayaccommodate at least a part of the substrate of the lens driving unit(1400). The substrate accommodation part (1340) may be formed by beingcaved in to an inside at a part of the external lateral surface of thesensor base (1300).

An adhesive member (1500) may be interposed between the sensor base(1300) and the lens driving unit (1400). The adhesive member (1500) maybe interposed between an upper surface of the sensor base (1300) and abottom surface of the lens driving unit (1400).

The lens driving unit (1400) may be coupled to an upper side of thesensor base (1300). The lens driving unit (1400) may be coupled to anupper surface of the sensor base (1300) by the adhesive member (1500).The lens driving unit (1400) may perform an autofocusing function bymoving the lens module (1700) to an optical axis direction. The lensdriving unit (1400) can perform the handshake correction function bymoving or tilting the lens module (1700) to a direction perpendicular tothe optical axis direction.

The lens driving unit (1400) may include a cover member (not shown), afirst rotor, a second rotor, a stator, a base, a support member and asensor part. However, any one or more of the cover member, the firstrotor, the second rotor, the stator, the base, the support member andthe sensor part in the lens driving unit (1400) according to the secondexemplary embodiment of the present disclosure may be omitted.

The lens driving unit (1400) according to the second exemplaryembodiment of the present disclosure may be applied with the explanationof the lens driving unit (700) according to the first exemplaryembodiment of the present disclosure.

The cover member may form an external shape of the lens driving unit(1400). The cover member may take a shape of a hexahedron opened at abottom surface. However, the present disclosure is not limited thereto.The cover member may include an upper plate and a lateral plate extendedfrom an outside of the upper plate to a bottom side. Meantime, a bottomend of the lateral plate of the cover member may be mounted on a base.An inner space formed by the cover member and the base may be disposedwith a first rotor, a second rotor, a stator and a support member.Furthermore, the cover member may be mounted on the base by beingtightly contacted at an inner lateral surface to a part or a whole areaof lateral surface of the base. Thus, the cover member can perform thefunctions of protecting inner constituent elements from outside shockand simultaneously preventing foreign objects from penetrating to aninside.

The cover member may be formed with a metal material, for example. To bemore specific, the cover member may be formed with a metal plate. Inthis case, the cover member can block electric wave interference. Thatis, the cover member can block the electric wave generated from outsideof the lens driving unit from entering an inside of the cover member.Furthermore, the cover member can block the electric wave generated frominside of the cover member from emitting to the outside of the covermember. However, the material of cover member is not limited thereto.

The cover member may include an opening formed at an upper plate toexpose the lens module (1700). The opening may be formed in a shapecorresponding to that of the lens module (1700). The size of the openingmay be formed to be greater than a diameter of the lens module (1700) toallow the lens module (1700) to be assembled through the opening.Furthermore, a light introduced through the opening may pass through thelens module (1700). Meantime, the light having passed the lens module(1700) may be transmitted to the image sensor.

The first rotor may be coupled with the lens module (1700). The lensmodule (1700) may be disposed at an inside of the first rotor. An innersurface of the first rotor may be coupled with an externalcircumferential surface of the lens module (1700). Meantime, the firstrotor may integrally move with the lens module (1700) through aninteraction with a second rotor. That is, the first rotor can move thelens module (1700).

The first rotor may include a bobbin and an AF coil part. The firstrotor may include a bobbin that is coupled with the lens module (1700).The first rotor may include an AF coil part disposed at the bobbin to bemoved by electromagnetic interaction with a driving magnet part.

The bobbin may be coupled with the lens module (1700). To be morespecific, the bobbin may be coupled at an inner circumferential surfaceby the external circumferential surface of the lens module (1700).Meantime, the bobbin may be coupled with the AF coil part. Furthermore,the bobbin may be coupled at a bottom surface with a bottom supportmember and may be coupled at an upper surface with an upper supportmember. The bobbin may be disposed at an inside of a housing. The bobbinmay relatively move to an optical axis direction relative to thehousing.

The bobbin may include a lens coupling part formed at an inside thereof.The lens coupling part may be coupled by the lens module (1700). Aninner circumferential surface of the lens coupling part may be formedwith a screw thread having a shape corresponding to that of a screwthread formed at the external circumferential surface of the lens module(1700). That is, an inner circumferential surface of the lens couplingpart may be screw-connected by the external circumferential surface ofthe lens module (1700). Meantime, an adhesive may be injected betweenthe lens module (1700) and the bobbin. At this time, the adhesive may bean epoxy that is cured (hardened) by UV (Ultraviolet). That is, the lensmodule (1700) and the bobbin may be adhered by UV-curing epoxy.Alternatively, the lens module (1700) and the bobbin may be adhered byheat-curing epoxy.

The bobbin may include a first driving part coupling part wound ormounted with an AF coil part. The first driving part coupling part maybe integrally formed with an external lateral surface of the bobbin.Furthermore, the first driving part coupling part may be continuouslyformed along the external lateral surface of the bobbin, or formed bybeing spaced apart at a predetermined distance. The first driving partcoupling part may include an indent part formed by a part of theexternal lateral surface of the bobbin being caved in. The indent partmay be disposed with an AF coil part, where the AF coil part may besupported by the first driving part coupling part.

By way of example, the first driving part coupling part may be formed byparts protruded at upper and bottom sides of the indent part beingdisposed, where a coil of the first driving part may be directly woundon the indent part of the first driving part coupling part.Alternatively, by way of another example, the first driving partcoupling part may take a shape of upper side or a bottom side of theindent part being opened, and formed at the other side by being disposedwith a hitching part, where the coil of the first driving part may becoupled by being inserted through the opened part while the coil is in apre-wound state.

The bobbin may include an upper coupling part coupled to an uppersupport member. The upper coupling part may be coupled to an innerlateral part of the upper support member. For example, a lug of theupper coupling part may be coupled by being inserted into a groove or ahole at the inner lateral part.

The bobbin may include a bottom coupling part coupled to a bottomsupport member. The bottom coupling part formed at a bottom surface ofthe bobbin may be coupled with an inner lateral part of the bottomsupport member. For example, a lug of the bottom coupling part may becoupled by being inserted into a groove or a hole of the inner lateralpart.

The AF coil part may be disposed by facing or being opposite to adriving magnet part of the second rotor. The AF coil part may move thebobbin through an electromagnetic interaction with the driving magnetpart relative to the housing. The AF coil part may include a coil. Thecoil may be guided by the first driving part coupling part to be woundon the external lateral surface of the bobbin. Furthermore, by way ofanother example, the AF coil part may be arranged at the externallateral surface of the bobbin to allow four independent coils to bedisposed and to allow two adjacent coils to form an angle of 90°therebetween.

The AF coil part may receive an electric power through the bottomsupport member. At this time, the bottom support member may be divisablyformed in a pair in order to supply the electric power to the AF coilpart. Meantime, the AG coil part may include a pair of leader lines inorder to supply the electric power to the AF coil part. In this case,each of the pair of leader lines on the AF coil part may be electricallycoupled to a pair of bottom support members. Alternatively, the AF coilpart may receive the electric power from the upper support member.

Meantime, the AF coil part may be formed at a surrounding with anelectromagnetic field when the power is supplied to the AF coil part. Byway of another example, the AF coil part and the driving magnet part maybe so arranged as to exchange their positions.

The second rotor may be disposed opposite to the first rotor at anexternal side of the first rotor. The second rotor may be supported by abase disposed at a bottom surface thereof. The second rotor may besupported by a fixed member. At this time, the fixed member may includea base and a stator. That is, the second rotor may be supported by thebase and/or the stator. The second rotor may be disposed at an innerspace of the cover member.

The second rotor may include a housing and a driving magnet part. Thesecond rotor may include a housing disposed at an outside of the bobbin.Furthermore, the second rotor may be disposed opposite to the AF coilpart to include a driving magnet part fixed to the housing.

At least one part of the housing may be formed with a shapecorresponding to that of an inner lateral surface of the cover member.Inter alia, an external lateral surface of the housing may be formedwith a shape corresponding to an inner lateral surface of a lateralplate of the cover member. The external lateral surface of the housingand the inner lateral surface of the lateral plate may be flatly formed.To be more specific, when the housing is at an initial position, theexternal lateral surface of the housing and the inner lateral surface ofthe lateral plate may be flatly formed.

In this case, when the housing is moved maximally to a cover memberside, the external lateral surface of the housing and the inner lateralsurface of the lateral plate may surface-contact to disperse a shockgenerated from the housing and/or the cover member. The housing may takea shape of a hexahedron including four lateral surfaces, for example.However, the shape of the housing may take any shape as long as thehousing is arranged inside the cover member. The housing may be coupledat an upper surface with the upper support member, and may be coupled ata bottom surface with the bottom support member.

The housing may be formed with an insulating material, and may be formedwith an injection-molded material in consideration of productivity. Thehousing is a moving part for OIS driving, and may be spaced apart fromthe cover member at a predetermine distance. However, in case of AFmodel, the housing may be fixed on the base. Alternatively, the housingmay be omitted in case of the AF model, and the driving magnet part maybe fixed on the cover member.

The housing may be opened at an upper side and a bottom side to movablyaccommodate the first rotor to a vertical direction. The housing mayinclude an upper/bottom opened inner space at an inside of the housing.The inner space may be movably disposed therein with a bobbin. That is,the inner space may take a shape corresponding to that of the bobbin.Furthermore, an inner circumferential surface of the housing forming theinner space may be spaced apart from the external circumferentialsurface of the bobbin. The housing may be movably supported relative tothe base. That is, the housing may be moved or tilted to a horizontaldirection based on the base.

The housing may include a second driving part coupling part formed at alateral surface with a shape corresponding to that of the driving magnetpart to accommodate the driving magnet part. That is, the second drivingpart coupling part may be fixed by accommodating the driving magnetpart. The driving magnet part may be fixed to the second driving partcoupling part by an adhesive. Meantime, the second driving part couplingpart may be disposed at an inner lateral part of housing, which isadvantageous to the electromagnetic interaction with the AF coil partdisposed at an inside of the driving magnet part. Furthermore, thesecond driving part coupling part may take a shape opened at a bottomsurface, for example, which is advantageous to the electromagneticinteraction between a substrate disposed at a bottom side of the drivingmagnet part and the driving magnet part. By way of example, a bottom endof the driving magnet part may be so disposed as to allow moreprotruding downward than a bottom end of the housing. The second drivingpart coupling part may be formed in the number of four (4), for example.Each of the second driving part coupling part may be coupled by thedriving magnet part.

The housing may include an upper coupling part coupled with the uppersupport member. The upper coupling part may be coupled to an externallateral part of the upper support member. By way of example, a lug ofthe upper coupling part may be coupled by being inserted into a grooveor a hole of the external lateral part.

The housing may include a bottom coupling part coupled to the bottomsupport member. The bottom coupling part formed at a bottom surface ofthe housing may be coupled to an external lateral part of the bottomsupport member. By way of example, a lug of the bottom coupling part maybe coupled by being inserted into a groove or a hole of the externallateral part.

The housing may include a first lateral surface, a second lateralsurface adjacent to the first lateral surface and a corner part disposedbetween the first and second lateral surfaces. The corner part of thehousing may be disposed with an upper stopper. The upper stopper may beoverlapped with the cover member to a vertical direction. When thehousing is moved upward by an external shock, the upper stopper mayrestrict an upward movement of the housing by being contacted to thecover member.

The driving magnet part may be disposed opposite to the AF coil part ofthe first rotor. The driving magnet part may move the AF coil partthrough the electromagnetic interaction with the AF coil part. Thedriving magnet part may include a magnet. The magnet may be fixed to thesecond driving part coupling part of the housing. The driving magnetpart may be arranged at the housing to allow four independent magnets tobe disposed and to allow two adjacent magnets to form an angle of 90°therebetween as illustrated in FIG. 10.

That is, the driving magnet part may be mounted at four lateral surfacesof the housing, each at an equidistance, to promote an efficient use ofan inner volume. Furthermore, the driving magnet part may be adhered tothe housing using an adhesive, but the present disclosure is not limitedthereto.

The stator may be disposed at the base. The stator may be disposedopposite to a bottom side of the second rotor. The stator may movablysupport the second rotor. The stator may move the second rotor. Thestator may be disposed at a center with a through hole corresponding tothe lens module (1700). Because the stator may be formed with a terminalpart (1401) to directly and electrically communicate with the outsideaccording to the second exemplary embodiment of the present disclosure,there is required no separate FPCB. Thus, the second exemplaryembodiment of the present disclosure may expect a cost reduction effectbecause the number of parts, the number of procedures and reducedprocess management points in comparison with a model that is separatelymounted with an FPCB and a pattern coil. Furthermore, the entire heightof the product is reduced to contribute to the miniaturization of theproduct.

The stator may include an OIS coil part and a substrate, for example.The stator may include an OIS coil part arranged at the substrate. Thestator may include a substrate accommodated at the base by beingdisposed opposite to a bottom side of the driving magnet part. Thestator may include a terminal part (1401) extended by being bent fromthe substrate to a bottom side.

The OIS coil part may face the driving magnet part. The OIS driving coilpart may move the driving magnet part through an electromagneticinteraction. When a power is applied to the OIS coil part, the drivingmagnet part and the housing fixed by the driving magnet part mayintegrally move through an electromagnetic interaction with the drivingmagnet part. The OIS coil part may be mounted on the substrate,electrically connected to the substrate or integrally formed with thesubstrate.

The OIS coil part may be an FP (Fine Pattern) coil, for example, and maybe arranged, mounted or formed at the substrate. The OIS coil part maybe so formed as to minimize an interference with an OIS sensor disposedat a bottom side, for example. The OIS coil part may be so formed as notto overlap with the OIS sensor to a vertical direction. The OIS sensormay be so mounted at a bottom side of the stator as to prevent overlapwith the OIS coil part to a vertical direction. The OIS coil part may bearranged by being changed in position with the driving magnet part.

The substrate may be accommodated on the base. Meantime, the substratecan supply an electric power to the AF coil part. By way of example, thesubstrate can supply the power to the AF coil part through a lateralsupport member, an upper support member, a current carrying member and abottom support member. Alternatively, the substrate can supply the powerto the AF coil part through the lateral support member and the uppersupport member.

The substrate may support from a bottom side in order to move or tiltthe housing to a horizontal direction. The substrate may be coupled withthe housing through the lateral support member. The substrate may bedisposed with an OIS sensor to detect a position or movement of thehousing. The substrate may be disposed at an upper surface with the OIScoil part, and may be disposed at a bottom surface with the OIS sensor.

The substrate may include a through hole. The substrate may include athrough hole allowing a light having passed the lens module (1700) topass therethrough. The through hole may be formed at a center of thesubstrate. The through hole may be formed with a round shape, but thepresent disclosure is not limited thereto.

The terminal part (1401) may be connected to an outside electric powersource through which the substrate is supplied with the power. Theterminal part (1401) may be formed by being extended from a lateral sideof the substrate. The terminal part (1401) may be disposed at both sidesof the substrate. The substrate and the terminal part (1401) may beintegrally formed. The terminal part (1401) may be formed to be smallerthan a width of the substrate. The terminal part (1401) may beaccommodated in to a terminal accommodation part formed by a part of alateral surface of the base being caved in. The terminal accommodationpart may be formed with a width corresponding to that of the terminalpart (1401).

The base may support the second rotor. The base may be disposed at abottom side with a sensor base (1300). Meantime, any one of the sensorbase (1300) and the base may be omitted, and the base and the sensorbase (1300) may be integrally formed. The base may include a throughhole formed at a position corresponding to that of the lens couplingpart of the bobbin.

The base may include a foreign object collection part collecting foreignobjects introduced into the cover member, for example. The foreignobject collection part may be disposed at a position at an upper surfaceof the base to collect foreign objects including an adhesive materialand a foreign object at an inside space formed by the cover member andthe base.

The base may include a sensor part accommodation groove coupled by theOIS sensor. That is, the ON sensor may be mounted on the sensor partaccommodation groove. At this time, the OIS sensor may detect ahorizontal movement or tilt of the housing by detecting a driving magnetpart coupled to the housing. The sensor part accommodation groove may beformed in the number of two (2), for example. Each of the two sensorpart accommodation grooves may be disposed with the OIS sensor. In thiscase, the OIS sensor may be so arranged as to detect both x axisdirection movement and y axis direction movement of the housing. Thatis, an imaginary line connecting each of the two OIS sensors and theoptical axis may cross at a right angle.

The support member may connect two or more of a first rotor, a secondrotor, a stator and a base. The support member may elastically connecttwo or more of the first rotor, the second rotor, the stator and thebase to enable a relative movement between each element. The supportmember may be formed with an elastic member. The support member mayinclude an upper support member, a bottom support member, a lateralsupport member and a current carrying member, for example. However, thecurrent carrying member is disposed to carry a current for the uppersupport member and the bottom support member, such that the currentcarrying member may be explained by being discerned from the uppersupport member, the bottom support member, and the lateral supportmember.

The upper support member may include an external part, an internal partand a connection part, for example. The upper support member may includean external part coupled to the housing, an internal part coupled to thebobbin and a connection part elastically connecting the external partand the internal part.

The upper support member may be connected to an upper surface of thefirst rotor and to an upper surface of the second rotor. To be morespecific, the upper support member may be coupled to an upper surface ofthe bobbin and to an upper surface of the housing. The internal part ofthe upper support member may be coupled to an upper lateral couplingpart of the bobbin, and the external part of the upper support membermay be coupled to an upper lateral coupling part of the housing.

The upper support member may be divisibly formed with six (6) uppercurrent carrying parts, for example. At this time, the two (2) uppercurrent carrying parts in the six current carrying parts may beelectrically connected to be used for applying an electric power to theAF coil part. Each of the two upper current carrying parts may beelectrically connected to each of a pair of bottom support membersthrough a current carrying member. The remaining four (4) upper currentcarrying parts of the six upper current carrying parts may beelectrically connected to the AF sensor part disposed at the bobbin. Theremaining four (4) upper current carrying parts may supply an electricpower to the AF sensor part and may be used for receipt and transmissionof information and signals between a controller and the AF sensor part.Furthermore, as a modification, the two upper current carrying parts ofthe six upper current carrying parts may be directly connected to the AFcoil part and the remaining four upper current carrying parts may beconnected to the AF sensor part.

The bottom support member may include a pair of bottom support members,for example. That is, the bottom support member may include a firstbottom support member and a second bottom support member. At this time,the bottom support member may be also explained as including two bottomcurrent carrying parts. Each of the first bottom support member and thesecond bottom support member can supply an electric power by beingconnected to each of a pair of leader lines on the AF coil part formedby a coil. Meantime, the pair of bottom support members may beelectrically connected to the OIS coil part. Through this type ofstructure, the pair of bottom support members can provide the electricpower supplied from the OIS coil part to the AF coil part.

The bottom support member may include an external part, an internal partand a connection part. The bottom support member may include an externalpart coupled to the housing, an internal part coupled to the bobbin anda connection part elastically connecting the external part and theinternal part.

The bottom support member may be connected to a bottom surface of thefirst rotor and to a bottom surface of the second rotor. To be morespecific, the bottom support member may be connected to a bottom surfaceof the bobbin and to a bottom surface of the housing. The internal partof the bottom support member may be coupled with a bottom coupling partof the bobbin, and the external part of the bottom support member may becoupled with a bottom coupling part of the housing.

The lateral support member may be coupled at one side to the statorand/or to the base, and may be coupled at the other side to the uppersupport member and/or to the second rotor. The lateral support membermay be coupled at one side to the stator and may be coupled at the otherside to the housing, for example. Furthermore, by way of anotherexample, the lateral support member may be coupled at one side to thebase and may be coupled at the other side to the upper support member.As noted above, the lateral support member may elastically support thesecond rotor to allow the second rotor to horizontally move or tiltrelative to the base.

The lateral support member may include a plurality of wires.Furthermore, the lateral support member may include a plurality of leafsprings. The lateral support member may be formed with the same numberas that of the upper support member, for example. That is, the lateralsupport member may be divided to in the number of six (6) to berespectively connected to the upper support members that are divided tosix pieces. In this case, the lateral support member can supply anelectric power supplied from the stator or from outside to each of theupper support members. The number of lateral support member may bedetermined in consideration of symmetry, for example. A total of eight(8) lateral support members, two-member each at a corner of the housing,may be formed, for example.

The lateral support member or the upper support member may include ashock absorption part in order to absorb a shock, for example. The shockabsorption part may be disposed on at least any one of the lateralsupport member and the upper support member. The shock absorption partmay be a separate member like a damper. Furthermore, the shockabsorption part may be realized by change in shape to more than one partof any one of the lateral support member and the upper support member.

The current carrying member may electrically connect the upper supportmember and the bottom support member. The current carrying member may beseparately formed from the lateral support member. The power supplied tothe upper support member through the current carrying member may besupplied to the bottom support member, and the power may be supplied tothe AF coil part through the bottom support member. Meantime, as amodification, when the upper support member is directly connected to theAF coil part, the current carrying member may be omitted.

The sensor part may be used for more than one of auto focus feedback andhandshake correction feedback. The sensor part may detect more than oneof position or movement of the first rotor and second rotor. The sensorpart may include an AF sensor part and an OIS sensor, for example. TheAF sensor part can provide information for AF feedback by sensing arelative vertical movement of the bobbin relative to the housing. TheOIS sensor can provide information for OIS feedback by detecting ahorizontal movement or a tilt of the second rotor.

The AF sensor part may be disposed at the first rotor. The AF sensorpart may be fixed by being inserted into a sensor guide groove formed atan external circumferential surface of the bobbin. The AF sensor partmay include a first sensor, a flexible PCB and a terminal part, forexample.

The first sensor may detect a movement or a position of the bobbin.Alternatively, the first sensor may detect a position of the drivingmagnet part mounted on the housing. The first sensor may be a Hallsensor, for example. In this case, the first sensor may detect arelative position change between the bobbin and the housing by detectinga magnetic force generated from the driving magnet part. The flexiblePCB may be mounted with a first sensor. The flexible PCB may be formedwith a strip shape, for example. At least a part of the flexible PCB maybe inserted into a sensor guide groove by being formed with a shapecorresponding to the sensor guide groove concavely formed at an uppersurface of the bobbin. The flexible PCB may be an FPCB. That is, theflexible PCB may be flexibly formed and bent in order to correspond tothe sensor guide groove in terms of shape. The flexible PCB may beformed with a terminal part.

The terminal part may supply an electric power to the first sensorthrough the flexible PCB by receiving the power. Furthermore, theterminal part may receive a control command relative to the first sensoror transmit a value sensed from the first sensor. The terminal part maybe provided in the number of four (4), and may be electrically connectedto the upper support member. In this case, two terminal parts may beused for receiving a power from the upper support member, and theremaining two terminal parts may be used for receiving or transmittinginformation or a signal.

The OIS sensor may be disposed at the stator. The OIS sensor may bedisposed at an upper surface or a bottom surface of the OIS coil part.The OIS sensor may be disposed at a sensor part accommodation grooveformed at the base by being arranged at a bottom surface of the OIS coilpart, for example. The OIS sensor may be a Hall sensor, for example. Inthis case, the OIS sensor can sense a relative movement of the secondrotor relative to the stator by sensing a magnetic field of the drivingmagnet part. The Hall sensor may be mounted on the substrate through theSMT (Surface Mounting Technology). The OIS sensor can detect both x axisand y axis movements of the second rotor by being formed in the numberof more than two.

The AF coil part, the OIS coil and the driving magnet part are elementsfor performing a mutually electromagnetic interaction, where any one ofthe AF coil part, the OIS coil and the driving magnet part may be calleda ‘first driving part’, another one may be called a ‘second drivingpart’, and the remaining one may be called a ‘third driving part’.Although the aforementioned description has explained that the AF coilis disposed on the bobbin, the driving magnet part is disposed on thehousing and the OIS coil is disposed on the substrate, the AF coil part,the OIS coil and the driving magnet part may be disposed by beingexchanged in their positions.

The substrate of the lens driving unit (1400) may include a terminalpart (1401). The terminal part (1401) may include a body part coupled tothe OIS coil, and a terminal part (1401) extended by being bent to abottom side from the body part. The terminal part (1401) may beaccommodated with at least a part of the substrate accommodation part(1340) of the sensor base (1300).

The adhesive member (1500) may be interposed between the lens drivingunit (1400) and the sensor base (1300). The adhesive member (1500) maybe disposed between a bottom surface of the lens driving unit (1400) andan upper surface of the sensor base (1300). The adhesive member (1500)may be cured by UV epoxy. The adhesive member (1500) is a liquefiedadhesive and may be cured by UV and cured in earnest by heat.

The filter (1600) may be accommodated in the filter accommodation part(1330). The filter (1600) may be disposed at an upper side of the imagesensor (1200). The filter (1600) may include a UV filter. The UV filtermay prevent a light of IR (Infrared) region from being incident on theimage sensor (1200). The UV filter may be interposed between the lensmodule (1700) and the image sensor (1200). The IR filter may be an IRabsorption filter absorbing the IR. Alternatively, the IR filter may bean IR reflection filter reflecting the IR. The filter (1600) may beformed with a film material or a glass material. The filter (1600) maybe formed by coating an IR cut-off coating material on a flat typeoptical filter such as an imaging surface protection cover glass or acover glass.

The lens module (1700) may include a lens and a lens barrel. The lensmodule (1700) may include one or more lenses and a lens barrelaccommodating one or more lenses. However, a configuration of the lensmodule (1700) is not limited to the lens barrel, and any structurecapable of holding one or more lenses may suffice for the lens module(1700). The lens module (1700) may move along with the lens driving unit(1400) by being coupled to the lens driving unit (1400). The lens module(1700) may be coupled to an inside of the lens driving unit (1400). Thelens module (1700) may be screw-connected to the lens driving unit(1400). The lens module (1700) may be coupled to the lens driving unit(1400) using an adhesive. Meantime, a light having passed through thelens module (1700) may be irradiated on the image sensor (1200).

A lens protection tape (1810) may be covered on an upper surface of thelens module (1700) in order to protect the lens module (170) againstdamage. The lens protection tape (1810) may be fixed on an upper surfaceof the lens driving unit (1400). The lens protection tape (1810) may beremoved in the course of assembling process.

An insulating tape (1820) may be arranged to cover a bottom surface ofthe circuit board (1100) and a part of a lateral surface of the lensdriving unit (1400). The insulating tape (1820) can prevent the terminalpart (1401) from being damaged by being disposed at an outside of theterminal part (1401) of the lens driving unit (1400) exposed to theoutside. The insulating tape (1820) may be removed in the course ofassembling process.

A connector (1830) may be electrically connected to the circuit board(1100). The connector (1830) may electrically connect a configuration ofoptical device with a camera module. That is, an image obtained throughthe camera module may be transmitted to other configurations inside theoptical device through the connector (1830).

Hereinafter, a manufacturing method and an effect of a camera moduleaccording to the second exemplary embodiment of the present disclosurewill be described with reference to the drawings.

The camera module according to the second exemplary embodiment of thepresent disclosure may be applied with an AA (Active Align) in thecourse of manufacturing process. To be more specific, the camera moduleaccording to the second exemplary embodiment of the present disclosuremay be prepared with a lens driving unit (1400) coupled with the lensmodule (1700) and the sensor base (1300) coupled to the circuit board(1100) mounted with the image sensor (1200) in order to assemble thecamera module. At this time, an upper surface of the sensor base (1300)may be coated with the adhesive member (1500) in order to encompass anoutside of the filter accommodation part (1330) as illustrated in FIG.9.

Thereafter, the upper surface of the sensor base (1300) is accommodatedwith the lens driving unit (1400) to align the lens module (1700) andthe image sensor (1200) for optical axis alignment. When the lens module(700) and the image sensor (1200) are aligned on the optical axis, an UVlight is irradiated between the sensor base (1300) and the lens drivingunit (1400) to temporarily cure the adhesive member (1500). At thistime, when the UV light is irradiated to the guide part (1310) disposedat the first to four corner parts (1305, 306, 307, 308), a much morequantity of UV light can be irradiated to the adhesive member (1500).Meantime, the assembly of the sensor base (1300) and the lens drivingunit (1400) under the temporarily coupled state by the temporarily curedadhesive member (1500) may be moved to an oven (not shown). The adhesionbetween the sensor base (1300) and the lens driving unit (1400) can becompleted in the oven by the in-earnest curing by heat.

However, when the guide part (1310) is not formed, the temporary curingcannot be performed in earnest due to a light-entering path beingnarrowed, because a distance between the sensor base (1300) and the lensdriving unit (1400) is merely 0.1˜0.2 mm.

That is, although the UV light is being irradiated from a lateral side,a light capable of curing an innermost area of the liquefied adhesivemember (1500) becomes insufficient, because the adhesive member (1500)is interposed between the sensor base (1300) and the lens driving unit(1400) where no light is transmitted. In this case, there may begenerated a phenomenon of a position of the lens driving unit (1400)being twisted relative to the sensor base (1300) during the transit.When the guide part (1310) is not formed, there may be generated adisadvantage of a curing time being lengthened or delayed in order tosecure temporary contact stability.

A chamfer-shaped guide part (1310) is formed at the corner parts (1305,306, 307, 308) of the sensor base (1300) according to the secondexemplary embodiment of the present disclosure to enable an obtainmentof a UV light transmission space.

That is, a UV light infuse space can be enlarged or broadened bysecuring a space among the corner parts (1305, 306, 307, 308) of thesensor base (1300) and a corner part of the lens driving unit (1400).Furthermore, the temporary contact stability relative to the lensposition can be increased by obtainment of the UV curing energy. Stillfurthermore, the productivity can be increased by reduction in curingtime.

Meantime, even if an adhesive reinforcing operation is performed inorder to securely couple the sensor base (1300) and the lens drivingunit (1400), a phenomenon of increasing the size of camera module due tothe guide part (1310) can be prevented according to the second exemplaryembodiment of the present disclosure. To be more specific, the guidepart (1310) can become a space where the adhesive coated forreinforcement operation is introduced to thereby prevent the adhesivefrom being protruded up to an outside of the sensor base (1300).Furthermore, when a slope angle of the guide part (1310) becomes near to90°, the reinforcing adhesive moved along the guide part (1310) can flowdown on the upper surface of the circuit board (1100), whereby theadhesive force can be improved and the dimensional stability can besecured.

Although the foregoing has explained that all the elements forming theexemplary embodiment of the present disclosure are coupled or operatedas one element, the present disclosure is not always limited to thegiven exemplary embodiments. That is, all the elements may be alsoselectively coupled or operated as one or more elements.

Furthermore, it is to be understood that the phraseology and terminologyused herein is for the purpose of description and should not be regardedas limiting. The use of “including,” “comprising,” or “having” andvariations thereof herein is meant to encompass the items listedthereafter and equivalents thereof as well as additional items. Unlessspecified or limited otherwise, the terms “mounted,” “connected,”“supported,” and “coupled” and variations thereof are used broadly andencompass both direct and indirect mountings, connections, supports, andcouplings. Further, “connected” and “coupled” are not restricted tophysical or mechanical connections or couplings.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

In the foregoing detailed description, only certain exemplaryembodiments of the present disclosure have been shown and described,simply by way of illustration. As those skilled in the art wouldrealize, the described embodiments may be modified in various differentways, all without departing from the spirit or scope of the presentdisclosure.

The aspects, embodiments, features, and examples of the invention are tobe considered illustrative in all respects and are not intended to limitthe invention, the scope of which is defined only by the claims. Otherembodiments, modifications, and usages will be apparent to those skilledin the art without departing from the spirit and scope of the claimedinvention.

The above disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments which fall within thetrue spirit and scope of the present disclosure. Thus, to the maximumextent allowed by law, the scope of the present disclosure is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. A camera module, the camera module comprising: acircuit board; an image sensor disposed on an upper surface of thecircuit board; a current carrying part electrically connecting the imagesensor and the circuit board; a base disposed on the upper surface ofthe circuit board; a circuit element unit arranged at the upper surfaceof the circuit board and arranged at an outside of the image sensor; acover member arranged at an upper side of the base; a lens modulearranged at an upper side of the image sensor; and a filter interposedbetween the lens module and the image sensor, wherein the base is notoverlapped with the image sensor and the current carrying part in adirection of an optical axis, wherein the base includes a filter supportpart supporting the filter, and a cover member support part supportingthe cover member, wherein the base is formed with an elementaccommodation part accommodating at least a part of the circuit elementunit, and wherein the element accommodation part is arranged between thefilter support part and the cover member support part.
 2. The cameramodule of claim 1, wherein the base includes a first support unitsupporting a part of a bottom surface of the filter, a second supportunit disposed opposite to a lateral surface of the filter, and a thirdsupport unit arranged at the upper surface of the circuit board toconnect the first and second support units.
 3. The camera module ofclaim 2, wherein a bottom surface of the first support unit contacts theupper surface of the circuit board.
 4. The camera module of claim 2,wherein a width of the first support unit in a direction perpendicularto a direction of the optical axis (hereinafter referred to as ‘opticalaxis direction) is broadened toward an upper side from a lower end ofthe first support unit.
 5. The camera module of claim 2, wherein anupper surface of the first support unit and an inner lateral surface ofthe first support unit form an acute angle.
 6. The camera module ofclaim 2, wherein a height of the second support unit in the optical axisdirection corresponds to a height of the filter in the optical axisdirection.
 7. The camera module of claim 2, wherein an upper surface ofthe filter and an upper surface of the second support unit are arrangedon one plane.
 8. The camera module of claim 2, wherein the filter isspaced apart from the image sensor and the current carrying part.
 9. Thecamera module of claim 2, wherein the filter is an IR absorption filteror an IR reflection filter.
 10. The camera module of claim 1, whereinthe current carrying part includes a wire coupled to an upper surface ofthe image sensor and the upper surface of the circuit board.
 11. Thecamera module of claim 10, wherein the wire is arranged at an externalside of the image sensor.
 12. The camera module of claim 1, wherein theelement accommodation part passes through the base in an optical axisdirection.
 13. The camera module of claim 1, wherein the base isinhibited from being overlapped with the circuit element unit in anoptical axis direction.
 14. The camera module of claim 1, wherein theelement accommodation part includes a first accommodation part arrangedat one side of the image sensor and a second accommodation part arrangedat the other side of the image sensor.
 15. A camera module, the cameramodule comprising: a circuit board; an image sensor disposed on an uppersurface of the circuit board: a current carrying part electricallyconnecting the image sensor and the circuit board; a base disposed onthe upper surface of the circuit board; a cover member arranged at anupper side of the base; a bobbin arranged at an inner side of the covermember; a first coil arranged at the bobbin; a magnet interposed betweenthe cover member and the bobbin to be opposite to the first coil; and asecond coil arranged at the base to be opposite to the magnet, whereinthe base is not overlapped with the image sensor and the currentcarrying part in a direction of an optical axis.
 16. A camera module,the camera module comprising: a circuit board; an image sensor disposedon an upper surface of the circuit board; a current carrying partelectrically connecting the image sensor and the circuit board; and abase disposed on the upper surface of the circuit board, wherein thebase is not overlapped with the image sensor and the current carryingpart in a direction of an optical axis, wherein the circuit element unitincludes first to fourth circuit elements, each element mutually spacedapart from the other elements, wherein the element accommodation partincludes a first accommodation part accommodating the first and secondcircuit elements, and a second accommodation part accommodating thethird and fourth circuit elements, and wherein the first accommodationpart and the second accommodation part are spaced apart from each otherby the base.
 17. An optical apparatus, the optical apparatus comprising:a main body, the camera module of claim 1 arranged at the main body tocapture an image of a subject, and a display part arranged at onesurface of the main body to output the image captured by the cameramodule.